Buckling-based measurements of mechanical moduli of thin films

Si Woo Hahm, Hyun Sik Hwang, Donyoung Kim, Dahl Young Khang

Research output: Contribution to journalArticle

9 Citations (Scopus)

Abstract

The buckling-based measurement of mechanical properties of material is reviewed here, which is a very useful technique for the characterization of thin films, nano- or molecular-scale materials, etc. This method is shown to be useful to measure elastic moduli of various thin films such as polymers, polyelectrolyte multilayers (PEM), single-wall carbon nanotubes (SWNT) and millimeter-thick polymer network substrates. Further, it is also shown that the mechanical properties of various organic electronic materials, which may find wide applications in flexible and/or stretchable electronic devices, can be measured by the buckling method. Due to its fast, simple nature, the method can be extended to many other materials, especially to materials existing in thin film form only. The method would be a valuable, complementary technique in mechanical characterization of materials to be added to existing methods such as tensile testing, nano-indentation, and other methods.

Original languageEnglish
Pages (from-to)157-168
Number of pages12
JournalElectronic Materials Letters
Volume5
Issue number4
DOIs
Publication statusPublished - 2009 Dec 1

Fingerprint

Buckling
Thin films
Polymers
Mechanical properties
Carbon Nanotubes
Tensile testing
Nanoindentation
Polyelectrolytes
Carbon nanotubes
Multilayers
Elastic moduli
Substrates

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials

Cite this

Hahm, Si Woo ; Hwang, Hyun Sik ; Kim, Donyoung ; Khang, Dahl Young. / Buckling-based measurements of mechanical moduli of thin films. In: Electronic Materials Letters. 2009 ; Vol. 5, No. 4. pp. 157-168.
@article{c6d5ab60b1b04e24af4d2e9fe3e03833,
title = "Buckling-based measurements of mechanical moduli of thin films",
abstract = "The buckling-based measurement of mechanical properties of material is reviewed here, which is a very useful technique for the characterization of thin films, nano- or molecular-scale materials, etc. This method is shown to be useful to measure elastic moduli of various thin films such as polymers, polyelectrolyte multilayers (PEM), single-wall carbon nanotubes (SWNT) and millimeter-thick polymer network substrates. Further, it is also shown that the mechanical properties of various organic electronic materials, which may find wide applications in flexible and/or stretchable electronic devices, can be measured by the buckling method. Due to its fast, simple nature, the method can be extended to many other materials, especially to materials existing in thin film form only. The method would be a valuable, complementary technique in mechanical characterization of materials to be added to existing methods such as tensile testing, nano-indentation, and other methods.",
author = "Hahm, {Si Woo} and Hwang, {Hyun Sik} and Donyoung Kim and Khang, {Dahl Young}",
year = "2009",
month = "12",
day = "1",
doi = "10.3365/eml.2009.12.157",
language = "English",
volume = "5",
pages = "157--168",
journal = "Electronic Materials Letters",
issn = "1738-8090",
publisher = "Springer Netherlands",
number = "4",

}

Buckling-based measurements of mechanical moduli of thin films. / Hahm, Si Woo; Hwang, Hyun Sik; Kim, Donyoung; Khang, Dahl Young.

In: Electronic Materials Letters, Vol. 5, No. 4, 01.12.2009, p. 157-168.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Buckling-based measurements of mechanical moduli of thin films

AU - Hahm, Si Woo

AU - Hwang, Hyun Sik

AU - Kim, Donyoung

AU - Khang, Dahl Young

PY - 2009/12/1

Y1 - 2009/12/1

N2 - The buckling-based measurement of mechanical properties of material is reviewed here, which is a very useful technique for the characterization of thin films, nano- or molecular-scale materials, etc. This method is shown to be useful to measure elastic moduli of various thin films such as polymers, polyelectrolyte multilayers (PEM), single-wall carbon nanotubes (SWNT) and millimeter-thick polymer network substrates. Further, it is also shown that the mechanical properties of various organic electronic materials, which may find wide applications in flexible and/or stretchable electronic devices, can be measured by the buckling method. Due to its fast, simple nature, the method can be extended to many other materials, especially to materials existing in thin film form only. The method would be a valuable, complementary technique in mechanical characterization of materials to be added to existing methods such as tensile testing, nano-indentation, and other methods.

AB - The buckling-based measurement of mechanical properties of material is reviewed here, which is a very useful technique for the characterization of thin films, nano- or molecular-scale materials, etc. This method is shown to be useful to measure elastic moduli of various thin films such as polymers, polyelectrolyte multilayers (PEM), single-wall carbon nanotubes (SWNT) and millimeter-thick polymer network substrates. Further, it is also shown that the mechanical properties of various organic electronic materials, which may find wide applications in flexible and/or stretchable electronic devices, can be measured by the buckling method. Due to its fast, simple nature, the method can be extended to many other materials, especially to materials existing in thin film form only. The method would be a valuable, complementary technique in mechanical characterization of materials to be added to existing methods such as tensile testing, nano-indentation, and other methods.

UR - http://www.scopus.com/inward/record.url?scp=77957674456&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=77957674456&partnerID=8YFLogxK

U2 - 10.3365/eml.2009.12.157

DO - 10.3365/eml.2009.12.157

M3 - Article

AN - SCOPUS:77957674456

VL - 5

SP - 157

EP - 168

JO - Electronic Materials Letters

JF - Electronic Materials Letters

SN - 1738-8090

IS - 4

ER -