Characteristics of electrodeposited CoWP capping layers using alkali-metal-free precursors

Yun Mi Namkoung, Hae Min Lee, Young Seon Son, Kangtaek Lee, Chang Koo Kim

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

CoWP films, used as a capping layer for a copper interconnection, were electrodeposited using alkali-metal-free precursors, and the effect of the electrolyte concentration on the film characteristics such as the thickness, composition, and microstructure was investigated. The current density and the film thickness increased with the concentration of cobalt, tungsten, and phosphorous precursors. When the cobalt ion concentration in the electrolyte was increased from 0.01 to 0.09M, the cobalt content in the film increased from 67 to 89 at%, while the tungsten and phosphorous contents decreased from 16 to 0.7 and 17 to 10 at%, respectively. The tungsten and phosphorous contents also increased as their corresponding concentrations increased in the electrolyte. Microstructural analyses showed that the tungsten and phosphorous content in the film greatly affected the crystallinity of the CoWP films electrodeposited using alkali-metal-free precursors.

Original languageEnglish
Pages (from-to)1596-1600
Number of pages5
JournalKorean Journal of Chemical Engineering
Volume27
Issue number5
DOIs
Publication statusPublished - 2010 Jul 12

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Alkali Metals
Alkali metals
Tungsten
Cobalt
Electrolytes
Film thickness
Copper
Current density
Ions
Microstructure
Chemical analysis

All Science Journal Classification (ASJC) codes

  • Chemistry(all)
  • Chemical Engineering(all)

Cite this

Namkoung, Yun Mi ; Lee, Hae Min ; Son, Young Seon ; Lee, Kangtaek ; Kim, Chang Koo. / Characteristics of electrodeposited CoWP capping layers using alkali-metal-free precursors. In: Korean Journal of Chemical Engineering. 2010 ; Vol. 27, No. 5. pp. 1596-1600.
@article{980d01bf31c04f8280d7d3e1ef592d21,
title = "Characteristics of electrodeposited CoWP capping layers using alkali-metal-free precursors",
abstract = "CoWP films, used as a capping layer for a copper interconnection, were electrodeposited using alkali-metal-free precursors, and the effect of the electrolyte concentration on the film characteristics such as the thickness, composition, and microstructure was investigated. The current density and the film thickness increased with the concentration of cobalt, tungsten, and phosphorous precursors. When the cobalt ion concentration in the electrolyte was increased from 0.01 to 0.09M, the cobalt content in the film increased from 67 to 89 at{\%}, while the tungsten and phosphorous contents decreased from 16 to 0.7 and 17 to 10 at{\%}, respectively. The tungsten and phosphorous contents also increased as their corresponding concentrations increased in the electrolyte. Microstructural analyses showed that the tungsten and phosphorous content in the film greatly affected the crystallinity of the CoWP films electrodeposited using alkali-metal-free precursors.",
author = "Namkoung, {Yun Mi} and Lee, {Hae Min} and Son, {Young Seon} and Kangtaek Lee and Kim, {Chang Koo}",
year = "2010",
month = "7",
day = "12",
doi = "10.1007/s11814-010-0235-2",
language = "English",
volume = "27",
pages = "1596--1600",
journal = "Korean Journal of Chemical Engineering",
issn = "0256-1115",
publisher = "Springer New York",
number = "5",

}

Characteristics of electrodeposited CoWP capping layers using alkali-metal-free precursors. / Namkoung, Yun Mi; Lee, Hae Min; Son, Young Seon; Lee, Kangtaek; Kim, Chang Koo.

In: Korean Journal of Chemical Engineering, Vol. 27, No. 5, 12.07.2010, p. 1596-1600.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Characteristics of electrodeposited CoWP capping layers using alkali-metal-free precursors

AU - Namkoung, Yun Mi

AU - Lee, Hae Min

AU - Son, Young Seon

AU - Lee, Kangtaek

AU - Kim, Chang Koo

PY - 2010/7/12

Y1 - 2010/7/12

N2 - CoWP films, used as a capping layer for a copper interconnection, were electrodeposited using alkali-metal-free precursors, and the effect of the electrolyte concentration on the film characteristics such as the thickness, composition, and microstructure was investigated. The current density and the film thickness increased with the concentration of cobalt, tungsten, and phosphorous precursors. When the cobalt ion concentration in the electrolyte was increased from 0.01 to 0.09M, the cobalt content in the film increased from 67 to 89 at%, while the tungsten and phosphorous contents decreased from 16 to 0.7 and 17 to 10 at%, respectively. The tungsten and phosphorous contents also increased as their corresponding concentrations increased in the electrolyte. Microstructural analyses showed that the tungsten and phosphorous content in the film greatly affected the crystallinity of the CoWP films electrodeposited using alkali-metal-free precursors.

AB - CoWP films, used as a capping layer for a copper interconnection, were electrodeposited using alkali-metal-free precursors, and the effect of the electrolyte concentration on the film characteristics such as the thickness, composition, and microstructure was investigated. The current density and the film thickness increased with the concentration of cobalt, tungsten, and phosphorous precursors. When the cobalt ion concentration in the electrolyte was increased from 0.01 to 0.09M, the cobalt content in the film increased from 67 to 89 at%, while the tungsten and phosphorous contents decreased from 16 to 0.7 and 17 to 10 at%, respectively. The tungsten and phosphorous contents also increased as their corresponding concentrations increased in the electrolyte. Microstructural analyses showed that the tungsten and phosphorous content in the film greatly affected the crystallinity of the CoWP films electrodeposited using alkali-metal-free precursors.

UR - http://www.scopus.com/inward/record.url?scp=77957975157&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=77957975157&partnerID=8YFLogxK

U2 - 10.1007/s11814-010-0235-2

DO - 10.1007/s11814-010-0235-2

M3 - Article

AN - SCOPUS:77957975157

VL - 27

SP - 1596

EP - 1600

JO - Korean Journal of Chemical Engineering

JF - Korean Journal of Chemical Engineering

SN - 0256-1115

IS - 5

ER -