Characteristics of thermal performance in high power LED package with heat pipe

Woong Joon Hwang, Hwa Jun Yeo, Moo Whan Shin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

This paper discusses about thermal performance of high power light emitted diode (HPLED) implemented with sintered metal wick type heat pipe(SWHP). The HPLED(2.5 W) samples were surface mounted device(SMD) package used in our experiments. The experiments were made for SWHP with diameters of 6.0 mm. The length of the SWHP is 150 mm. The working fluid in the heat pipes is pure water. The electrical-thermal transient technique was employed for the junction temperature measurement. It was found that the SWHP leads to decreased of thermal resistance by 35 % compared with a simple copper bar in oil bath (forced cooling condition). Employment of copper cap as a LED attachment was more advantageous over the phosphor bronze. After the increase of input power, the thermal resistance of HPLED package has decreased with the increase of effective thermal conductivity of SWHP.

Original languageEnglish
Title of host publicationAdvances in Nanomaterials and Processing - IUMRS - ICA - 2006 International Conference in Asia
PublisherTrans Tech Publications Ltd
Pages85-88
Number of pages4
Volume124-126
EditionPART 1
ISBN (Print)3908451310, 9783908451310
Publication statusPublished - 2007 Jan 1
EventIUMRS International Conference in Asia 2006, IUMRS-ICA 2006 - Jeju, Korea, Republic of
Duration: 2006 Sep 102006 Sep 14

Publication series

NameSolid State Phenomena
NumberPART 1
Volume124-126
ISSN (Print)1012-0394

Other

OtherIUMRS International Conference in Asia 2006, IUMRS-ICA 2006
CountryKorea, Republic of
CityJeju
Period06/9/1006/9/14

Fingerprint

heat pipes
Heat pipes
wicks
Light emitting diodes
light emitting diodes
Metals
Diodes
metals
diodes
thermal resistance
Heat resistance
Copper
copper
Surface mount technology
working fluids
Bronze
bronzes
caps
Temperature measurement
Phosphors

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Physics and Astronomy (miscellaneous)
  • Condensed Matter Physics
  • Electronic, Optical and Magnetic Materials

Cite this

Hwang, W. J., Yeo, H. J., & Shin, M. W. (2007). Characteristics of thermal performance in high power LED package with heat pipe. In Advances in Nanomaterials and Processing - IUMRS - ICA - 2006 International Conference in Asia (PART 1 ed., Vol. 124-126, pp. 85-88). (Solid State Phenomena; Vol. 124-126, No. PART 1). Trans Tech Publications Ltd.
Hwang, Woong Joon ; Yeo, Hwa Jun ; Shin, Moo Whan. / Characteristics of thermal performance in high power LED package with heat pipe. Advances in Nanomaterials and Processing - IUMRS - ICA - 2006 International Conference in Asia. Vol. 124-126 PART 1. ed. Trans Tech Publications Ltd, 2007. pp. 85-88 (Solid State Phenomena; PART 1).
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title = "Characteristics of thermal performance in high power LED package with heat pipe",
abstract = "This paper discusses about thermal performance of high power light emitted diode (HPLED) implemented with sintered metal wick type heat pipe(SWHP). The HPLED(2.5 W) samples were surface mounted device(SMD) package used in our experiments. The experiments were made for SWHP with diameters of 6.0 mm. The length of the SWHP is 150 mm. The working fluid in the heat pipes is pure water. The electrical-thermal transient technique was employed for the junction temperature measurement. It was found that the SWHP leads to decreased of thermal resistance by 35 {\%} compared with a simple copper bar in oil bath (forced cooling condition). Employment of copper cap as a LED attachment was more advantageous over the phosphor bronze. After the increase of input power, the thermal resistance of HPLED package has decreased with the increase of effective thermal conductivity of SWHP.",
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Hwang, WJ, Yeo, HJ & Shin, MW 2007, Characteristics of thermal performance in high power LED package with heat pipe. in Advances in Nanomaterials and Processing - IUMRS - ICA - 2006 International Conference in Asia. PART 1 edn, vol. 124-126, Solid State Phenomena, no. PART 1, vol. 124-126, Trans Tech Publications Ltd, pp. 85-88, IUMRS International Conference in Asia 2006, IUMRS-ICA 2006, Jeju, Korea, Republic of, 06/9/10.

Characteristics of thermal performance in high power LED package with heat pipe. / Hwang, Woong Joon; Yeo, Hwa Jun; Shin, Moo Whan.

Advances in Nanomaterials and Processing - IUMRS - ICA - 2006 International Conference in Asia. Vol. 124-126 PART 1. ed. Trans Tech Publications Ltd, 2007. p. 85-88 (Solid State Phenomena; Vol. 124-126, No. PART 1).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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N2 - This paper discusses about thermal performance of high power light emitted diode (HPLED) implemented with sintered metal wick type heat pipe(SWHP). The HPLED(2.5 W) samples were surface mounted device(SMD) package used in our experiments. The experiments were made for SWHP with diameters of 6.0 mm. The length of the SWHP is 150 mm. The working fluid in the heat pipes is pure water. The electrical-thermal transient technique was employed for the junction temperature measurement. It was found that the SWHP leads to decreased of thermal resistance by 35 % compared with a simple copper bar in oil bath (forced cooling condition). Employment of copper cap as a LED attachment was more advantageous over the phosphor bronze. After the increase of input power, the thermal resistance of HPLED package has decreased with the increase of effective thermal conductivity of SWHP.

AB - This paper discusses about thermal performance of high power light emitted diode (HPLED) implemented with sintered metal wick type heat pipe(SWHP). The HPLED(2.5 W) samples were surface mounted device(SMD) package used in our experiments. The experiments were made for SWHP with diameters of 6.0 mm. The length of the SWHP is 150 mm. The working fluid in the heat pipes is pure water. The electrical-thermal transient technique was employed for the junction temperature measurement. It was found that the SWHP leads to decreased of thermal resistance by 35 % compared with a simple copper bar in oil bath (forced cooling condition). Employment of copper cap as a LED attachment was more advantageous over the phosphor bronze. After the increase of input power, the thermal resistance of HPLED package has decreased with the increase of effective thermal conductivity of SWHP.

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Hwang WJ, Yeo HJ, Shin MW. Characteristics of thermal performance in high power LED package with heat pipe. In Advances in Nanomaterials and Processing - IUMRS - ICA - 2006 International Conference in Asia. PART 1 ed. Vol. 124-126. Trans Tech Publications Ltd. 2007. p. 85-88. (Solid State Phenomena; PART 1).