Characteristics of thermal performance in high power LED package with heat pipe

Woong Joon Hwang; Hwa Jun Yeo; Moo Whan Shin

Characteristics of thermal performance in high power LED package with heat pipe

Woong Joon Hwang, Hwa Jun Yeo, Moo Whan Shin

School of Integrated Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

This paper discusses about thermal performance of high power light emitted diode (HPLED) implemented with sintered metal wick type heat pipe(SWHP). The HPLED(2.5 W) samples were surface mounted device(SMD) package used in our experiments. The experiments were made for SWHP with diameters of 6.0 mm. The length of the SWHP is 150 mm. The working fluid in the heat pipes is pure water. The electrical-thermal transient technique was employed for the junction temperature measurement. It was found that the SWHP leads to decreased of thermal resistance by 35 % compared with a simple copper bar in oil bath (forced cooling condition). Employment of copper cap as a LED attachment was more advantageous over the phosphor bronze. After the increase of input power, the thermal resistance of HPLED package has decreased with the increase of effective thermal conductivity of SWHP.

Original language	English
Title of host publication	Advances in Nanomaterials and Processing - IUMRS - ICA - 2006 International Conference in Asia
Publisher	Trans Tech Publications Ltd
Pages	85-88
Number of pages	4
Volume	124-126
Edition	PART 1
ISBN (Print)	3908451310, 9783908451310
Publication status	Published - 2007 Jan 1
Event	IUMRS International Conference in Asia 2006, IUMRS-ICA 2006 - Jeju, Korea, Republic of Duration: 2006 Sep 10 → 2006 Sep 14

Publication series

Name	Solid State Phenomena
Number	PART 1
Volume	124-126
ISSN (Print)	1012-0394

Other

Other	IUMRS International Conference in Asia 2006, IUMRS-ICA 2006
Country	Korea, Republic of
City	Jeju
Period	06/9/10 → 06/9/14

All Science Journal Classification (ASJC) codes

Materials Science(all)
Physics and Astronomy (miscellaneous)
Condensed Matter Physics
Electronic, Optical and Magnetic Materials

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Hwang, W. J., Yeo, H. J., & Shin, M. W. (2007). Characteristics of thermal performance in high power LED package with heat pipe. In Advances in Nanomaterials and Processing - IUMRS - ICA - 2006 International Conference in Asia (PART 1 ed., Vol. 124-126, pp. 85-88). (Solid State Phenomena; Vol. 124-126, No. PART 1). Trans Tech Publications Ltd.

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title = "Characteristics of thermal performance in high power LED package with heat pipe",

abstract = "This paper discusses about thermal performance of high power light emitted diode (HPLED) implemented with sintered metal wick type heat pipe(SWHP). The HPLED(2.5 W) samples were surface mounted device(SMD) package used in our experiments. The experiments were made for SWHP with diameters of 6.0 mm. The length of the SWHP is 150 mm. The working fluid in the heat pipes is pure water. The electrical-thermal transient technique was employed for the junction temperature measurement. It was found that the SWHP leads to decreased of thermal resistance by 35 % compared with a simple copper bar in oil bath (forced cooling condition). Employment of copper cap as a LED attachment was more advantageous over the phosphor bronze. After the increase of input power, the thermal resistance of HPLED package has decreased with the increase of effective thermal conductivity of SWHP.",

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Hwang, WJ, Yeo, HJ & Shin, MW 2007, Characteristics of thermal performance in high power LED package with heat pipe. in Advances in Nanomaterials and Processing - IUMRS - ICA - 2006 International Conference in Asia. PART 1 edn, vol. 124-126, Solid State Phenomena, no. PART 1, vol. 124-126, Trans Tech Publications Ltd, pp. 85-88, IUMRS International Conference in Asia 2006, IUMRS-ICA 2006, Jeju, Korea, Republic of, 06/9/10.

Characteristics of thermal performance in high power LED package with heat pipe. / Hwang, Woong Joon; Yeo, Hwa Jun; Shin, Moo Whan.

Advances in Nanomaterials and Processing - IUMRS - ICA - 2006 International Conference in Asia. Vol. 124-126 PART 1. ed. Trans Tech Publications Ltd, 2007. p. 85-88 (Solid State Phenomena; Vol. 124-126, No. PART 1).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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N2 - This paper discusses about thermal performance of high power light emitted diode (HPLED) implemented with sintered metal wick type heat pipe(SWHP). The HPLED(2.5 W) samples were surface mounted device(SMD) package used in our experiments. The experiments were made for SWHP with diameters of 6.0 mm. The length of the SWHP is 150 mm. The working fluid in the heat pipes is pure water. The electrical-thermal transient technique was employed for the junction temperature measurement. It was found that the SWHP leads to decreased of thermal resistance by 35 % compared with a simple copper bar in oil bath (forced cooling condition). Employment of copper cap as a LED attachment was more advantageous over the phosphor bronze. After the increase of input power, the thermal resistance of HPLED package has decreased with the increase of effective thermal conductivity of SWHP.

AB - This paper discusses about thermal performance of high power light emitted diode (HPLED) implemented with sintered metal wick type heat pipe(SWHP). The HPLED(2.5 W) samples were surface mounted device(SMD) package used in our experiments. The experiments were made for SWHP with diameters of 6.0 mm. The length of the SWHP is 150 mm. The working fluid in the heat pipes is pure water. The electrical-thermal transient technique was employed for the junction temperature measurement. It was found that the SWHP leads to decreased of thermal resistance by 35 % compared with a simple copper bar in oil bath (forced cooling condition). Employment of copper cap as a LED attachment was more advantageous over the phosphor bronze. After the increase of input power, the thermal resistance of HPLED package has decreased with the increase of effective thermal conductivity of SWHP.

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