Characteristics of thermal performance in high power LED package with heat pipe

Woong Joon Hwang; Hwa Jun Yeo; Moo Whan Shin

doi:10.4028/3-908451-31-0.85

Characteristics of thermal performance in high power LED package with heat pipe

Woong Joon Hwang, Hwa Jun Yeo, Moo Whan Shin

School of Integrated Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

This paper discusses about thermal performance of high power light emitted diode (HPLED) implemented with sintered metal wick type heat pipe(SWHP). The HPLED(2.5 W) samples were surface mounted device(SMD) package used in our experiments. The experiments were made for SWHP with diameters of 6.0 mm. The length of the SWHP is 150 mm. The working fluid in the heat pipes is pure water. The electrical-thermal transient technique was employed for the junction temperature measurement. It was found that the SWHP leads to decreased of thermal resistance by 35 % compared with a simple copper bar in oil bath (forced cooling condition). Employment of copper cap as a LED attachment was more advantageous over the phosphor bronze. After the increase of input power, the thermal resistance of HPLED package has decreased with the increase of effective thermal conductivity of SWHP.

Original language	English
Title of host publication	Advances in Nanomaterials and Processing - IUMRS - ICA - 2006 International Conference in Asia
Publisher	Trans Tech Publications Ltd
Pages	85-88
Number of pages	4
Edition	PART 1
ISBN (Print)	3908451310, 9783908451310
DOIs	https://doi.org/10.4028/3-908451-31-0.85
Publication status	Published - 2007
Event	IUMRS International Conference in Asia 2006, IUMRS-ICA 2006 - Jeju, Korea, Republic of Duration: 2006 Sep 10 → 2006 Sep 14

Publication series

Name	Solid State Phenomena
Number	PART 1
Volume	124-126
ISSN (Print)	1012-0394

Other

Other	IUMRS International Conference in Asia 2006, IUMRS-ICA 2006
Country	Korea, Republic of
City	Jeju
Period	06/9/10 → 06/9/14

All Science Journal Classification (ASJC) codes

Atomic and Molecular Physics, and Optics
Materials Science(all)
Condensed Matter Physics

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Hwang, W. J., Yeo, H. J., & Shin, M. W. (2007). Characteristics of thermal performance in high power LED package with heat pipe. In Advances in Nanomaterials and Processing - IUMRS - ICA - 2006 International Conference in Asia (PART 1 ed., pp. 85-88). (Solid State Phenomena; Vol. 124-126, No. PART 1). Trans Tech Publications Ltd. https://doi.org/10.4028/3-908451-31-0.85

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title = "Characteristics of thermal performance in high power LED package with heat pipe",

abstract = "This paper discusses about thermal performance of high power light emitted diode (HPLED) implemented with sintered metal wick type heat pipe(SWHP). The HPLED(2.5 W) samples were surface mounted device(SMD) package used in our experiments. The experiments were made for SWHP with diameters of 6.0 mm. The length of the SWHP is 150 mm. The working fluid in the heat pipes is pure water. The electrical-thermal transient technique was employed for the junction temperature measurement. It was found that the SWHP leads to decreased of thermal resistance by 35 % compared with a simple copper bar in oil bath (forced cooling condition). Employment of copper cap as a LED attachment was more advantageous over the phosphor bronze. After the increase of input power, the thermal resistance of HPLED package has decreased with the increase of effective thermal conductivity of SWHP.",

author = "Hwang, {Woong Joon} and Yeo, {Hwa Jun} and Shin, {Moo Whan}",

year = "2007",

doi = "10.4028/3-908451-31-0.85",

language = "English",

isbn = "3908451310",

series = "Solid State Phenomena",

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pages = "85--88",

booktitle = "Advances in Nanomaterials and Processing - IUMRS - ICA - 2006 International Conference in Asia",

edition = "PART 1",

note = "IUMRS International Conference in Asia 2006, IUMRS-ICA 2006 ; Conference date: 10-09-2006 Through 14-09-2006",

}

Hwang, WJ, Yeo, HJ & Shin, MW 2007, Characteristics of thermal performance in high power LED package with heat pipe. in Advances in Nanomaterials and Processing - IUMRS - ICA - 2006 International Conference in Asia. PART 1 edn, Solid State Phenomena, no. PART 1, vol. 124-126, Trans Tech Publications Ltd, pp. 85-88, IUMRS International Conference in Asia 2006, IUMRS-ICA 2006, Jeju, Korea, Republic of, 06/9/10. https://doi.org/10.4028/3-908451-31-0.85

Characteristics of thermal performance in high power LED package with heat pipe. / Hwang, Woong Joon; Yeo, Hwa Jun; Shin, Moo Whan.

Advances in Nanomaterials and Processing - IUMRS - ICA - 2006 International Conference in Asia. PART 1. ed. Trans Tech Publications Ltd, 2007. p. 85-88 (Solid State Phenomena; Vol. 124-126, No. PART 1).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Characteristics of thermal performance in high power LED package with heat pipe

AU - Hwang, Woong Joon

AU - Yeo, Hwa Jun

AU - Shin, Moo Whan

PY - 2007

Y1 - 2007

N2 - This paper discusses about thermal performance of high power light emitted diode (HPLED) implemented with sintered metal wick type heat pipe(SWHP). The HPLED(2.5 W) samples were surface mounted device(SMD) package used in our experiments. The experiments were made for SWHP with diameters of 6.0 mm. The length of the SWHP is 150 mm. The working fluid in the heat pipes is pure water. The electrical-thermal transient technique was employed for the junction temperature measurement. It was found that the SWHP leads to decreased of thermal resistance by 35 % compared with a simple copper bar in oil bath (forced cooling condition). Employment of copper cap as a LED attachment was more advantageous over the phosphor bronze. After the increase of input power, the thermal resistance of HPLED package has decreased with the increase of effective thermal conductivity of SWHP.

AB - This paper discusses about thermal performance of high power light emitted diode (HPLED) implemented with sintered metal wick type heat pipe(SWHP). The HPLED(2.5 W) samples were surface mounted device(SMD) package used in our experiments. The experiments were made for SWHP with diameters of 6.0 mm. The length of the SWHP is 150 mm. The working fluid in the heat pipes is pure water. The electrical-thermal transient technique was employed for the junction temperature measurement. It was found that the SWHP leads to decreased of thermal resistance by 35 % compared with a simple copper bar in oil bath (forced cooling condition). Employment of copper cap as a LED attachment was more advantageous over the phosphor bronze. After the increase of input power, the thermal resistance of HPLED package has decreased with the increase of effective thermal conductivity of SWHP.

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SN - 3908451310

SN - 9783908451310

T3 - Solid State Phenomena

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BT - Advances in Nanomaterials and Processing - IUMRS - ICA - 2006 International Conference in Asia

PB - Trans Tech Publications Ltd

T2 - IUMRS International Conference in Asia 2006, IUMRS-ICA 2006

Y2 - 10 September 2006 through 14 September 2006

ER -

Characteristics of thermal performance in high power LED package with heat pipe

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