Characteristics of thermal performance in high power LED package with heat pipe

Woong Joon Hwang, Hwa Jun Yeo, Moo Whan Shin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

This paper discusses about thermal performance of high power light emitted diode (HPLED) implemented with sintered metal wick type heat pipe(SWHP). The HPLED(2.5 W) samples were surface mounted device(SMD) package used in our experiments. The experiments were made for SWHP with diameters of 6.0 mm. The length of the SWHP is 150 mm. The working fluid in the heat pipes is pure water. The electrical-thermal transient technique was employed for the junction temperature measurement. It was found that the SWHP leads to decreased of thermal resistance by 35 % compared with a simple copper bar in oil bath (forced cooling condition). Employment of copper cap as a LED attachment was more advantageous over the phosphor bronze. After the increase of input power, the thermal resistance of HPLED package has decreased with the increase of effective thermal conductivity of SWHP.

Original languageEnglish
Title of host publicationAdvances in Nanomaterials and Processing - IUMRS - ICA - 2006 International Conference in Asia
PublisherTrans Tech Publications Ltd
Pages85-88
Number of pages4
EditionPART 1
ISBN (Print)3908451310, 9783908451310
DOIs
Publication statusPublished - 2007
EventIUMRS International Conference in Asia 2006, IUMRS-ICA 2006 - Jeju, Korea, Republic of
Duration: 2006 Sep 102006 Sep 14

Publication series

NameSolid State Phenomena
NumberPART 1
Volume124-126
ISSN (Print)1012-0394

Other

OtherIUMRS International Conference in Asia 2006, IUMRS-ICA 2006
CountryKorea, Republic of
CityJeju
Period06/9/1006/9/14

All Science Journal Classification (ASJC) codes

  • Atomic and Molecular Physics, and Optics
  • Materials Science(all)
  • Condensed Matter Physics

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  • Cite this

    Hwang, W. J., Yeo, H. J., & Shin, M. W. (2007). Characteristics of thermal performance in high power LED package with heat pipe. In Advances in Nanomaterials and Processing - IUMRS - ICA - 2006 International Conference in Asia (PART 1 ed., pp. 85-88). (Solid State Phenomena; Vol. 124-126, No. PART 1). Trans Tech Publications Ltd. https://doi.org/10.4028/3-908451-31-0.85