Abstract
This paper discusses about thermal performance of high power light emitted diode (HPLED) implemented with sintered metal wick type heat pipe(SWHP). The HPLED(2.5 W) samples were surface mounted device(SMD) package used in our experiments. The experiments were made for SWHP with diameters of 6.0 mm. The length of the SWHP is 150 mm. The working fluid in the heat pipes is pure water. The electrical-thermal transient technique was employed for the junction temperature measurement. It was found that the SWHP leads to decreased of thermal resistance by 35 % compared with a simple copper bar in oil bath (forced cooling condition). Employment of copper cap as a LED attachment was more advantageous over the phosphor bronze. After the increase of input power, the thermal resistance of HPLED package has decreased with the increase of effective thermal conductivity of SWHP.
| Original language | English |
|---|---|
| Title of host publication | Advances in Nanomaterials and Processing - IUMRS - ICA - 2006 International Conference in Asia |
| Publisher | Trans Tech Publications Ltd |
| Pages | 85-88 |
| Number of pages | 4 |
| Volume | 124-126 |
| Edition | PART 1 |
| ISBN (Print) | 3908451310, 9783908451310 |
| Publication status | Published - 2007 Jan 1 |
| Event | IUMRS International Conference in Asia 2006, IUMRS-ICA 2006 - Jeju, Korea, Republic of Duration: 2006 Sep 10 → 2006 Sep 14 |
Publication series
| Name | Solid State Phenomena |
|---|---|
| Number | PART 1 |
| Volume | 124-126 |
| ISSN (Print) | 1012-0394 |
Other
| Other | IUMRS International Conference in Asia 2006, IUMRS-ICA 2006 |
|---|---|
| Country | Korea, Republic of |
| City | Jeju |
| Period | 06/9/10 → 06/9/14 |
Fingerprint
All Science Journal Classification (ASJC) codes
- Materials Science(all)
- Physics and Astronomy (miscellaneous)
- Condensed Matter Physics
- Electronic, Optical and Magnetic Materials
Cite this
}
Characteristics of thermal performance in high power LED package with heat pipe. / Hwang, Woong Joon; Yeo, Hwa Jun; Shin, Moo Whan.
Advances in Nanomaterials and Processing - IUMRS - ICA - 2006 International Conference in Asia. Vol. 124-126 PART 1. ed. Trans Tech Publications Ltd, 2007. p. 85-88 (Solid State Phenomena; Vol. 124-126, No. PART 1).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - Characteristics of thermal performance in high power LED package with heat pipe
AU - Hwang, Woong Joon
AU - Yeo, Hwa Jun
AU - Shin, Moo Whan
PY - 2007/1/1
Y1 - 2007/1/1
N2 - This paper discusses about thermal performance of high power light emitted diode (HPLED) implemented with sintered metal wick type heat pipe(SWHP). The HPLED(2.5 W) samples were surface mounted device(SMD) package used in our experiments. The experiments were made for SWHP with diameters of 6.0 mm. The length of the SWHP is 150 mm. The working fluid in the heat pipes is pure water. The electrical-thermal transient technique was employed for the junction temperature measurement. It was found that the SWHP leads to decreased of thermal resistance by 35 % compared with a simple copper bar in oil bath (forced cooling condition). Employment of copper cap as a LED attachment was more advantageous over the phosphor bronze. After the increase of input power, the thermal resistance of HPLED package has decreased with the increase of effective thermal conductivity of SWHP.
AB - This paper discusses about thermal performance of high power light emitted diode (HPLED) implemented with sintered metal wick type heat pipe(SWHP). The HPLED(2.5 W) samples were surface mounted device(SMD) package used in our experiments. The experiments were made for SWHP with diameters of 6.0 mm. The length of the SWHP is 150 mm. The working fluid in the heat pipes is pure water. The electrical-thermal transient technique was employed for the junction temperature measurement. It was found that the SWHP leads to decreased of thermal resistance by 35 % compared with a simple copper bar in oil bath (forced cooling condition). Employment of copper cap as a LED attachment was more advantageous over the phosphor bronze. After the increase of input power, the thermal resistance of HPLED package has decreased with the increase of effective thermal conductivity of SWHP.
UR - http://www.scopus.com/inward/record.url?scp=38549100778&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=38549100778&partnerID=8YFLogxK
M3 - Conference contribution
SN - 3908451310
SN - 9783908451310
VL - 124-126
T3 - Solid State Phenomena
SP - 85
EP - 88
BT - Advances in Nanomaterials and Processing - IUMRS - ICA - 2006 International Conference in Asia
PB - Trans Tech Publications Ltd
ER -