Characterization methodology of transparent hard coating film on transparent substrates using capacitance-voltage measurement

Sang Myung Lee, Dongseok Shin, Ilgu Yun

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Roll-to-roll process is widely studied for the next generation low-cost flexible display application. Maintaining the thickness uniformity of the coated layer on the transparent substrate is crucial for high-yield roll-to-roll process. However, it is hard to characterize the large-area uniformity by the conventional techniques such as ellipsometer. In this work, the capacitance-voltage measurement method is used to characterize the thickness of the transparent layers. For the experiments, the urethane-series compound polymer material is used for the coated layer on the polycarbonate substrate. After the process, the relationship between coating speed and thickness uniformity of the coated layer is then examined using capacitance-voltage measurement data.

Original languageEnglish
Title of host publication2016 International Conference on Electronics Packaging, ICEP 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages145-148
Number of pages4
ISBN (Electronic)9784904090176
DOIs
Publication statusPublished - 2016 Jun 7
Event2016 International Conference on Electronics Packaging, ICEP 2016 - Hokkaido, Japan
Duration: 2016 Apr 202016 Apr 22

Publication series

Name2016 International Conference on Electronics Packaging, ICEP 2016

Other

Other2016 International Conference on Electronics Packaging, ICEP 2016
CountryJapan
CityHokkaido
Period16/4/2016/4/22

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All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering
  • Mechanics of Materials

Cite this

Lee, S. M., Shin, D., & Yun, I. (2016). Characterization methodology of transparent hard coating film on transparent substrates using capacitance-voltage measurement. In 2016 International Conference on Electronics Packaging, ICEP 2016 (pp. 145-148). [7486800] (2016 International Conference on Electronics Packaging, ICEP 2016). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICEP.2016.7486800