Characterization of channel strain evolution upon the silicidation of recessed source/drain Si1-xGex structures

S. W. Kim, J. H. Yoo, S. M. Koo, Dae Hong Ko, H. J. Lee

Research output: Contribution to journalArticle

11 Citations (Scopus)

Abstract

This letter reports on Ni germanosilicide formation on recessed Si 0.82Ge0.18 source/drain structures and its effects on channel strain. A combination of transmission electron microscopy techniques, including nanobeam diffraction, shed some light on a previously unrecognized factor in the channel strain evolution during silicidation: a Ge accumulation layer produced at the bottom of the germanosilicide layer. The formation of such a Ge rich layer added an additional compressive strain to the channel strain upon moderate silicidation, while the contribution of thermal strain arising from the cooling cycle became dominant in an excessively silicided sample, which turned the channel strain into a tensile value.

Original languageEnglish
Article number133107
JournalApplied Physics Letters
Volume99
Issue number13
DOIs
Publication statusPublished - 2011 Sep 26

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cooling
transmission electron microscopy
cycles
diffraction

All Science Journal Classification (ASJC) codes

  • Physics and Astronomy (miscellaneous)

Cite this

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Characterization of channel strain evolution upon the silicidation of recessed source/drain Si1-xGex structures. / Kim, S. W.; Yoo, J. H.; Koo, S. M.; Ko, Dae Hong; Lee, H. J.

In: Applied Physics Letters, Vol. 99, No. 13, 133107, 26.09.2011.

Research output: Contribution to journalArticle

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