Characterization of plated via hole fences for isolation between stripline circuits in LTCC packages

George E. Ponchak, Donghoon Chen, Jong Gwan Yook, Linda P.B. Katehi

Research output: Contribution to journalConference article

25 Citations (Scopus)

Abstract

Reduced coupling between adjacent striplines in LTCC packages is commonly accomplished by walls made of plated via holes. In this paper, a 3D-FEM electromagnetic simulation of stripline with filled via fences on both sides is presented. It is shown that the radiation loss of the stripline and the coupling between striplines increases if the fence is placed too close to the stripline.

Original languageEnglish
Pages (from-to)1831-1834
Number of pages4
JournalIEEE MTT-S International Microwave Symposium Digest
Volume3
Publication statusPublished - 1998 Jan 1
EventProceedings of the 1998 IEEE MTT-S International Microwave Symposium. Part 1 (of 3) - Baltimore, MD, USA
Duration: 1998 Jun 71998 Jun 12

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All Science Journal Classification (ASJC) codes

  • Radiation
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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