Conventional lithography using photons and electrons continues to evolve to scale down three-dimensional nanoscale patterns, but the complexity of technology and equipment is increasing due to diffraction and scattering problems. Physical contact lithography methods, such as nanoimprint and soft lithography, have been developed as an alternative technique. These techniques imprint predefined structures on a stamp to the polymer resist and use the polymer resist as a mask to dry etch the nanostructure on the substrate. In this study, we introduce a method of chemically imprinting crystalline silicon (Si) with a catalytic stamp to enable the direct etching of the Si without using a polymer mask. A metal catalyst is deposited on the predefined structure of the stamp. The stamp physically contacts the Si in the etching bath, and metal-assisted chemical etching occurs on the semiconductor surface. Since the metal catalyst is mounted on a stamp, it can be used repeatedly. This is a technology that combines conventional lithography and etching without using a polymer resist. This technology not only produced nano/microscale arrays of circular and square holes and trench structures but also successfully produced complex eagle-shaped structures that contained such structures.
Bibliographical noteFunding Information:
This research was supported by the MSIT (Ministry of Science and ICT), Korea, under the ICT Consilience Creative program (IITP-2017-2017-0-01015) supervised by the IITP (Institute for Information & Communications Technology Promotion). This research was also supported by the Basic Science Research Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Education, Science, and Technology (2016R1D1A1A09918647).
© 2017 American Chemical Society.
All Science Journal Classification (ASJC) codes
- Materials Science(all)
- Physics and Astronomy(all)