Collapse of stamps for soft lithography due to interfacial adhesion

K. J. Hsia, Y. Huang, E. Menard, Jang-Ung Park, W. Zhou, J. Rogers, J. M. Fulton

Research output: Contribution to journalArticle

84 Citations (Scopus)

Abstract

Collapse of elastomeric elements used for pattern transfer in soft lithography is studied through experimental measurements and theoretical modeling. The objective is to identify the driving force for such collapse. Two potential driving forces, the self-weight of the stamp and the interfacial adhesion, are investigated. An idealized configuration of periodic rectangular grooves and flat punches is considered. Experimental observations demonstrate that groove collapse occurs regardless of whether the gravitational force promotes or suppresses such collapse, indicating that self-weight is not the driving force. On the other hand, model predictions based on the postulation that interfacial adhesion is the driving force exhibit excellent agreement with the experimentally measured collapse behavior. The interfacial adhesion energy is also evaluated by matching an adhesion parameter in the model with the experimental data.

Original languageEnglish
Article number154106
Pages (from-to)1-3
Number of pages3
JournalApplied Physics Letters
Volume86
Issue number15
DOIs
Publication statusPublished - 2005 Jul 4

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adhesion
lithography
grooves
punches
configurations
predictions
energy

All Science Journal Classification (ASJC) codes

  • Physics and Astronomy (miscellaneous)

Cite this

Hsia, K. J., Huang, Y., Menard, E., Park, J-U., Zhou, W., Rogers, J., & Fulton, J. M. (2005). Collapse of stamps for soft lithography due to interfacial adhesion. Applied Physics Letters, 86(15), 1-3. [154106]. https://doi.org/10.1063/1.1900303
Hsia, K. J. ; Huang, Y. ; Menard, E. ; Park, Jang-Ung ; Zhou, W. ; Rogers, J. ; Fulton, J. M. / Collapse of stamps for soft lithography due to interfacial adhesion. In: Applied Physics Letters. 2005 ; Vol. 86, No. 15. pp. 1-3.
@article{ab1e87d8ae124659856e821348f9f00a,
title = "Collapse of stamps for soft lithography due to interfacial adhesion",
abstract = "Collapse of elastomeric elements used for pattern transfer in soft lithography is studied through experimental measurements and theoretical modeling. The objective is to identify the driving force for such collapse. Two potential driving forces, the self-weight of the stamp and the interfacial adhesion, are investigated. An idealized configuration of periodic rectangular grooves and flat punches is considered. Experimental observations demonstrate that groove collapse occurs regardless of whether the gravitational force promotes or suppresses such collapse, indicating that self-weight is not the driving force. On the other hand, model predictions based on the postulation that interfacial adhesion is the driving force exhibit excellent agreement with the experimentally measured collapse behavior. The interfacial adhesion energy is also evaluated by matching an adhesion parameter in the model with the experimental data.",
author = "Hsia, {K. J.} and Y. Huang and E. Menard and Jang-Ung Park and W. Zhou and J. Rogers and Fulton, {J. M.}",
year = "2005",
month = "7",
day = "4",
doi = "10.1063/1.1900303",
language = "English",
volume = "86",
pages = "1--3",
journal = "Applied Physics Letters",
issn = "0003-6951",
publisher = "American Institute of Physics Publising LLC",
number = "15",

}

Hsia, KJ, Huang, Y, Menard, E, Park, J-U, Zhou, W, Rogers, J & Fulton, JM 2005, 'Collapse of stamps for soft lithography due to interfacial adhesion', Applied Physics Letters, vol. 86, no. 15, 154106, pp. 1-3. https://doi.org/10.1063/1.1900303

Collapse of stamps for soft lithography due to interfacial adhesion. / Hsia, K. J.; Huang, Y.; Menard, E.; Park, Jang-Ung; Zhou, W.; Rogers, J.; Fulton, J. M.

In: Applied Physics Letters, Vol. 86, No. 15, 154106, 04.07.2005, p. 1-3.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Collapse of stamps for soft lithography due to interfacial adhesion

AU - Hsia, K. J.

AU - Huang, Y.

AU - Menard, E.

AU - Park, Jang-Ung

AU - Zhou, W.

AU - Rogers, J.

AU - Fulton, J. M.

PY - 2005/7/4

Y1 - 2005/7/4

N2 - Collapse of elastomeric elements used for pattern transfer in soft lithography is studied through experimental measurements and theoretical modeling. The objective is to identify the driving force for such collapse. Two potential driving forces, the self-weight of the stamp and the interfacial adhesion, are investigated. An idealized configuration of periodic rectangular grooves and flat punches is considered. Experimental observations demonstrate that groove collapse occurs regardless of whether the gravitational force promotes or suppresses such collapse, indicating that self-weight is not the driving force. On the other hand, model predictions based on the postulation that interfacial adhesion is the driving force exhibit excellent agreement with the experimentally measured collapse behavior. The interfacial adhesion energy is also evaluated by matching an adhesion parameter in the model with the experimental data.

AB - Collapse of elastomeric elements used for pattern transfer in soft lithography is studied through experimental measurements and theoretical modeling. The objective is to identify the driving force for such collapse. Two potential driving forces, the self-weight of the stamp and the interfacial adhesion, are investigated. An idealized configuration of periodic rectangular grooves and flat punches is considered. Experimental observations demonstrate that groove collapse occurs regardless of whether the gravitational force promotes or suppresses such collapse, indicating that self-weight is not the driving force. On the other hand, model predictions based on the postulation that interfacial adhesion is the driving force exhibit excellent agreement with the experimentally measured collapse behavior. The interfacial adhesion energy is also evaluated by matching an adhesion parameter in the model with the experimental data.

UR - http://www.scopus.com/inward/record.url?scp=20844437052&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=20844437052&partnerID=8YFLogxK

U2 - 10.1063/1.1900303

DO - 10.1063/1.1900303

M3 - Article

VL - 86

SP - 1

EP - 3

JO - Applied Physics Letters

JF - Applied Physics Letters

SN - 0003-6951

IS - 15

M1 - 154106

ER -