Comparative studies on thermal and laser sintering for highly conductive Cu films printable on plastic substrate

Myungo Joo; Byoungyoon Lee; Sooncheol Jeong; Myeongkyu Lee

doi:10.1016/j.tsf.2011.11.078

Comparative studies on thermal and laser sintering for highly conductive Cu films printable on plastic substrate

Myungo Joo, Byoungyoon Lee, Sooncheol Jeong, Myeongkyu Lee

Department of Materials Science and Engineering

Research output: Contribution to journal › Article

48 Citations (Scopus)

Abstract

Compound-based Cu paste was synthesized to prepare electrically conductive films on plastic substrate. The Cu pastes screen-printed onto polyimide were annealed inside a furnace and also by an ultraviolet laser beam and the effects of annealing conditions on the microstructures and electrical properties were investigated. Both of thermal and laser processes were carried out under N ₂ gas flow, which was very effective in preventing oxidation. The minimum resistivity available with thermal sintering was 1.30 × 10 ^{- 5} Ω cm and a slightly higher resistivity was obtained by laser sintering. This value is several orders of magnitude lower than that reported for the copper nanoparticle paste thermally sintered under N ₂ atmosphere. The variation of microstructure and electrical property with the laser power was very similar to the temperature dependence of these factors in thermal sintering.

Original language	English
Pages (from-to)	2878-2883
Number of pages	6
Journal	Thin Solid Films
Volume	520
Issue number	7
DOIs	https://doi.org/10.1016/j.tsf.2011.11.078
Publication status	Published - 2012 Jan 31

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Surfaces and Interfaces
Surfaces, Coatings and Films
Metals and Alloys
Materials Chemistry

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10.1016/j.tsf.2011.11.078

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Joo, M., Lee, B., Jeong, S., & Lee, M. (2012). Comparative studies on thermal and laser sintering for highly conductive Cu films printable on plastic substrate. Thin Solid Films, 520(7), 2878-2883. https://doi.org/10.1016/j.tsf.2011.11.078

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