The deposition of high-quality ZrO2 films has been achieved using both pulsed plasma-enhanced chemical vapor deposition (P-PE-CVD) and plasma-enhanced atomic layer deposition (PE-ALD) with (C5H5)Zr[N(CH3)2]3 as a Zr precursor. The authors compared the growth characteristics, chemical compositions, and electrical properties of P-PE-CVD and PE-ALD ZrO2 prepared under various deposition conditions. The ZrO2 films prepared using both methods showed high purity and good stoichiometry. Electrical characterization of a metal-oxide-semiconductor capacitor utilizing the ZrO2 films showed that PE-ALD films have a relatively lower leakage current than P-PE-CVD films, whereas the dielectric constant, interface trap density, and hysteresis of both films are similar. Applying both methods, the electrical properties of ZrO2 films were also evaluated using In-Ga-Zn-O thin-film transistors (TFTs), which showed a good device performance in terms of high Ion-Ioff ratios (>108) and low off-currents (<10−11 A). In addition, ZrO2-based TFT showed high reliability against a negative Vth shift. Based on the self-limiting growth characteristics and electrical properties of P-PE-CVD, the authors found that the P-PE-CVD process results in electrical properties comparable to those of PE-ALD ZrO2 films. Thus, the authors believe that P-PE-CVD can be an alternative process to PE-ALD for future electronic device applications, especially for display applications due to its good electrical properties with high throughput.
|Journal||Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films|
|Publication status||Published - 2017 May 1|
Bibliographical notePublisher Copyright:
© 2017 American Vacuum Society.
All Science Journal Classification (ASJC) codes
- Condensed Matter Physics
- Surfaces and Interfaces
- Surfaces, Coatings and Films