Comparison of the agglomeration behavior of Au and Cu films sputter deposited on silicon dioxide

Jang Yeon Kwon, Tae Sik Yoon, Ki Bum Kim, Seok Hong Min

Research output: Contribution to journalArticle

140 Citations (Scopus)

Abstract

A study was performed on the agglomeration behavior of Au and Cu films with a thickness of 5 and 50 nm deposited on thermal SiO2 substrate. It was reported that the Au films agglomerate through void nucleation at the initial stage and grow subsequently with snowflake-like branches. It was found that the agglomeration of Cu films followed the grain boundary grooving process.

Original languageEnglish
Pages (from-to)3270-3278
Number of pages9
JournalJournal of Applied Physics
Volume93
Issue number6
DOIs
Publication statusPublished - 2003 Mar 15

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agglomeration
silicon dioxide
grooving
voids
grain boundaries
nucleation

All Science Journal Classification (ASJC) codes

  • Physics and Astronomy(all)

Cite this

Kwon, Jang Yeon ; Yoon, Tae Sik ; Kim, Ki Bum ; Min, Seok Hong. / Comparison of the agglomeration behavior of Au and Cu films sputter deposited on silicon dioxide. In: Journal of Applied Physics. 2003 ; Vol. 93, No. 6. pp. 3270-3278.
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Comparison of the agglomeration behavior of Au and Cu films sputter deposited on silicon dioxide. / Kwon, Jang Yeon; Yoon, Tae Sik; Kim, Ki Bum; Min, Seok Hong.

In: Journal of Applied Physics, Vol. 93, No. 6, 15.03.2003, p. 3270-3278.

Research output: Contribution to journalArticle

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