A study was performed on the agglomeration behavior of Au and Cu films with a thickness of 5 and 50 nm deposited on thermal SiO2 substrate. It was reported that the Au films agglomerate through void nucleation at the initial stage and grow subsequently with snowflake-like branches. It was found that the agglomeration of Cu films followed the grain boundary grooving process.
|Number of pages||9|
|Journal||Journal of Applied Physics|
|Publication status||Published - 2003 Mar 15|
All Science Journal Classification (ASJC) codes
- Physics and Astronomy(all)