Comparison of the agglomeration behavior of Au and Cu films sputter deposited on silicon dioxide

Jang Yeon Kwon; Tae Sik Yoon; Ki Bum Kim; Seok Hong Min

doi:10.1063/1.1556178

Comparison of the agglomeration behavior of Au and Cu films sputter deposited on silicon dioxide

Jang Yeon Kwon, Tae Sik Yoon, Ki Bum Kim, Seok Hong Min

School of Integrated Technology

Research output: Contribution to journal › Article › peer-review

174 Citations (Scopus)

Abstract

A study was performed on the agglomeration behavior of Au and Cu films with a thickness of 5 and 50 nm deposited on thermal SiO₂ substrate. It was reported that the Au films agglomerate through void nucleation at the initial stage and grow subsequently with snowflake-like branches. It was found that the agglomeration of Cu films followed the grain boundary grooving process.

Original language	English
Pages (from-to)	3270-3278
Number of pages	9
Journal	Journal of Applied Physics
Volume	93
Issue number	6
DOIs	https://doi.org/10.1063/1.1556178
Publication status	Published - 2003 Mar 15

All Science Journal Classification (ASJC) codes

Physics and Astronomy(all)

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10.1063/1.1556178

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title = "Comparison of the agglomeration behavior of Au and Cu films sputter deposited on silicon dioxide",

abstract = "A study was performed on the agglomeration behavior of Au and Cu films with a thickness of 5 and 50 nm deposited on thermal SiO2 substrate. It was reported that the Au films agglomerate through void nucleation at the initial stage and grow subsequently with snowflake-like branches. It was found that the agglomeration of Cu films followed the grain boundary grooving process.",

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AB - A study was performed on the agglomeration behavior of Au and Cu films with a thickness of 5 and 50 nm deposited on thermal SiO2 substrate. It was reported that the Au films agglomerate through void nucleation at the initial stage and grow subsequently with snowflake-like branches. It was found that the agglomeration of Cu films followed the grain boundary grooving process.

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Comparison of the agglomeration behavior of Au and Cu films sputter deposited on silicon dioxide

Abstract

All Science Journal Classification (ASJC) codes

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