Comparison of the agglomeration behavior of Au and Cu films sputter deposited on silicon dioxide

Jang Yeon Kwon, Tae Sik Yoon, Ki Bum Kim, Seok Hong Min

Research output: Contribution to journalArticle

151 Citations (Scopus)


A study was performed on the agglomeration behavior of Au and Cu films with a thickness of 5 and 50 nm deposited on thermal SiO2 substrate. It was reported that the Au films agglomerate through void nucleation at the initial stage and grow subsequently with snowflake-like branches. It was found that the agglomeration of Cu films followed the grain boundary grooving process.

Original languageEnglish
Pages (from-to)3270-3278
Number of pages9
JournalJournal of Applied Physics
Issue number6
Publication statusPublished - 2003 Mar 15


All Science Journal Classification (ASJC) codes

  • Physics and Astronomy(all)

Cite this