Computation of switching noise in PCBs for digital packages

Jong Gwan Yook, V. Chandramouli, Linda P. Katehi, Karem A. Sakallah

Research output: Contribution to conferencePaper

Abstract

Simultaneous switching noise in printed circuit boards for digital packages is computed using a hybrid technique which combines electromagnetic analysis (3D FEM) and circuit simulation (HSPICE) for fast and efficient time and frequency domain analysis.

Original languageEnglish
Pages37-39
Number of pages3
Publication statusPublished - 1995 Dec 1
EventProceedings of the IEEE 4th Topical Meeting on Electrical Performance of Electronic Packaging - Portland, OR, USA
Duration: 1995 Oct 21995 Oct 4

Other

OtherProceedings of the IEEE 4th Topical Meeting on Electrical Performance of Electronic Packaging
CityPortland, OR, USA
Period95/10/295/10/4

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Frequency domain analysis
Time domain analysis
Circuit simulation
Polychlorinated biphenyls
Printed circuit boards
Finite element method

All Science Journal Classification (ASJC) codes

  • Engineering(all)

Cite this

Yook, J. G., Chandramouli, V., Katehi, L. P., & Sakallah, K. A. (1995). Computation of switching noise in PCBs for digital packages. 37-39. Paper presented at Proceedings of the IEEE 4th Topical Meeting on Electrical Performance of Electronic Packaging, Portland, OR, USA, .
Yook, Jong Gwan ; Chandramouli, V. ; Katehi, Linda P. ; Sakallah, Karem A. / Computation of switching noise in PCBs for digital packages. Paper presented at Proceedings of the IEEE 4th Topical Meeting on Electrical Performance of Electronic Packaging, Portland, OR, USA, .3 p.
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year = "1995",
month = "12",
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language = "English",
pages = "37--39",
note = "Proceedings of the IEEE 4th Topical Meeting on Electrical Performance of Electronic Packaging ; Conference date: 02-10-1995 Through 04-10-1995",

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Yook, JG, Chandramouli, V, Katehi, LP & Sakallah, KA 1995, 'Computation of switching noise in PCBs for digital packages' Paper presented at Proceedings of the IEEE 4th Topical Meeting on Electrical Performance of Electronic Packaging, Portland, OR, USA, 95/10/2 - 95/10/4, pp. 37-39.

Computation of switching noise in PCBs for digital packages. / Yook, Jong Gwan; Chandramouli, V.; Katehi, Linda P.; Sakallah, Karem A.

1995. 37-39 Paper presented at Proceedings of the IEEE 4th Topical Meeting on Electrical Performance of Electronic Packaging, Portland, OR, USA, .

Research output: Contribution to conferencePaper

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AU - Katehi, Linda P.

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Yook JG, Chandramouli V, Katehi LP, Sakallah KA. Computation of switching noise in PCBs for digital packages. 1995. Paper presented at Proceedings of the IEEE 4th Topical Meeting on Electrical Performance of Electronic Packaging, Portland, OR, USA, .