Computation of switching noise in PCBs for digital packages

Jong Gwan Yook, V. Chandramouli, Linda P. Katehi, Karem A. Sakallah

Research output: Contribution to conferencePaper

Abstract

Simultaneous switching noise in printed circuit boards for digital packages is computed using a hybrid technique which combines electromagnetic analysis (3D FEM) and circuit simulation (HSPICE) for fast and efficient time and frequency domain analysis.

Original languageEnglish
Pages37-39
Number of pages3
Publication statusPublished - 1995 Dec 1
EventProceedings of the IEEE 4th Topical Meeting on Electrical Performance of Electronic Packaging - Portland, OR, USA
Duration: 1995 Oct 21995 Oct 4

Other

OtherProceedings of the IEEE 4th Topical Meeting on Electrical Performance of Electronic Packaging
CityPortland, OR, USA
Period95/10/295/10/4

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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  • Cite this

    Yook, J. G., Chandramouli, V., Katehi, L. P., & Sakallah, K. A. (1995). Computation of switching noise in PCBs for digital packages. 37-39. Paper presented at Proceedings of the IEEE 4th Topical Meeting on Electrical Performance of Electronic Packaging, Portland, OR, USA, .