Computation of switching noise in PCBs for digital packages

Jong Gwan Yook, V. Chandramouli, Linda P. Katehi, Karem A. Sakallah

Research output: Contribution to conferencePaperpeer-review

Abstract

Simultaneous switching noise in printed circuit boards for digital packages is computed using a hybrid technique which combines electromagnetic analysis (3D FEM) and circuit simulation (HSPICE) for fast and efficient time and frequency domain analysis.

Original languageEnglish
Pages37-39
Number of pages3
Publication statusPublished - 1995
EventProceedings of the IEEE 4th Topical Meeting on Electrical Performance of Electronic Packaging - Portland, OR, USA
Duration: 1995 Oct 21995 Oct 4

Other

OtherProceedings of the IEEE 4th Topical Meeting on Electrical Performance of Electronic Packaging
CityPortland, OR, USA
Period95/10/295/10/4

All Science Journal Classification (ASJC) codes

  • Engineering(all)

Fingerprint Dive into the research topics of 'Computation of switching noise in PCBs for digital packages'. Together they form a unique fingerprint.

Cite this