Conducting Polymer Dough for Deformable Electronics

Oh Jin Young; Sunghee Kim; Hong Koo Baik; Unyong Jeong

doi:10.1002/adma.201502947

Conducting Polymer Dough for Deformable Electronics

Oh Jin Young, Sunghee Kim, Hong Koo Baik, Unyong Jeong

Department of Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

208 Citations (Scopus)

Original language	English
Pages (from-to)	4455-4461
Number of pages	7
Journal	Advanced Materials
Volume	28
Issue number	22
DOIs	https://doi.org/10.1002/adma.201502947
Publication status	Published - 2016 Jun

All Science Journal Classification (ASJC) codes

Materials Science(all)
Mechanics of Materials
Mechanical Engineering

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10.1002/adma.201502947

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@article{17b7780eb6a34156bb3670815a9d12ca,

title = "Conducting Polymer Dough for Deformable Electronics",

author = "{Jin Young}, Oh and Sunghee Kim and Baik, {Hong Koo} and Unyong Jeong",

year = "2016",

month = jun,

doi = "10.1002/adma.201502947",

language = "English",

volume = "28",

pages = "4455--4461",

journal = "Advanced Materials",

issn = "0935-9648",

publisher = "Wiley-VCH Verlag",

number = "22",

}

TY - JOUR

T1 - Conducting Polymer Dough for Deformable Electronics

AU - Jin Young, Oh

AU - Kim, Sunghee

AU - Baik, Hong Koo

AU - Jeong, Unyong

PY - 2016/6

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M3 - Article

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VL - 28

SP - 4455

EP - 4461

JO - Advanced Materials

JF - Advanced Materials

IS - 22

ER -

Conducting Polymer Dough for Deformable Electronics

All Science Journal Classification (ASJC) codes

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