Conducting Polymer Dough for Deformable Electronics

Oh Jin Young, Sunghee Kim, Hong Koo Baik, Unyong Jeong

Research output: Contribution to journalArticlepeer-review

125 Citations (Scopus)
Original languageEnglish
Pages (from-to)4455-4461
Number of pages7
JournalAdvanced Materials
Volume28
Issue number22
DOIs
Publication statusPublished - 2016 Jun

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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