Conductive Polyaniline for Potential Application in Anisotropic Conductive Films

Yong Seok Ha, Hong Gyu Park, Dae-Shik Seo

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

Polyaniline (PANI) was investigated for use in bonding packages of flexible printed circuit boards (FPCB). The contact resistance of the anisotropic conductive film used in the current study was significantly lower than that of the PANI powder, with an average contact resistance of 0.47 Ω, as compared to 7.1 Ω for the PANI powder. Nevertheless, the suitability of PANI for conductive ball bonding was investigated via bonding of a FPCB, and the possibility for the use of PANI as the core polymer in conductive balls was determined by simulating the ohmic loss and signal distortion.

Original languageEnglish
Pages (from-to)1200-1205
Number of pages6
JournalJournal of Electronic Materials
Volume44
Issue number4
DOIs
Publication statusPublished - 2015 Jan 1

Fingerprint

Conductive films
Polyaniline
printed circuits
circuit boards
contact resistance
balls
signal distortion
Contact resistance
Printed circuit boards
Powders
Signal distortion
polymers
Polymers
polyaniline

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

Cite this

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Conductive Polyaniline for Potential Application in Anisotropic Conductive Films. / Ha, Yong Seok; Park, Hong Gyu; Seo, Dae-Shik.

In: Journal of Electronic Materials, Vol. 44, No. 4, 01.01.2015, p. 1200-1205.

Research output: Contribution to journalArticle

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AB - Polyaniline (PANI) was investigated for use in bonding packages of flexible printed circuit boards (FPCB). The contact resistance of the anisotropic conductive film used in the current study was significantly lower than that of the PANI powder, with an average contact resistance of 0.47 Ω, as compared to 7.1 Ω for the PANI powder. Nevertheless, the suitability of PANI for conductive ball bonding was investigated via bonding of a FPCB, and the possibility for the use of PANI as the core polymer in conductive balls was determined by simulating the ohmic loss and signal distortion.

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