Direct contact-pressing metallization is introduced and demonstrated as a method for metallization. In this contact-pressing metallization, a free sheet of metal or a deposited film supported on a polymer-coated carrier wafer is placed on a substrate with contact or via holes and then pressed against the substrate between the platens of a hydraulic press. Plastic deformation caused by high temperature pressing is the mechanism by which the holes are filled. This conceptually simple and yet effective method can be an alternative to other metallization techniques.
|Number of pages||24|
|Journal||Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures|
|Publication status||Published - 2001 Sep|
All Science Journal Classification (ASJC) codes
- Condensed Matter Physics
- Electrical and Electronic Engineering