Contact resistance reduction between Ni–InGaAs and n-InGaAs via rapid thermal annealing in hydrogen atmosphere

Jeongchan Lee, Meng Li, Jeyoung Kim, Geonho Shin, Ga Won Lee, Jungwoo Oh, Hi Deok Lee

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1 Citation (Scopus)


Recently, Ni-InGaAs has been required for high-performance III-V MOSFETs as a promising self-aligned material for doped source/drain region. As downscaling of device proceeds, reduction of contact resistance (Rc) between Ni-InGaAs and n-InGaAs has become a challenge for higher performance of MOSFETs. In this paper, we compared three types of sample, vacuum, 2% H2 and 4% H2 annealing condition in rapid thermal annealing (RTA) step, to verify the reduction of Rc at Ni-InGaAs/n-InGaAs interface. Current-voltage (I-V) characteristic of metal-semiconductor contact indicated the lowest Rc in 4% H2 sample, that is, higher current for 4% H2 sample than other samples. The result of this work could be useful for performance improvement of InGaAs n-MOSFETs.

Original languageEnglish
Pages (from-to)283-287
Number of pages5
JournalJournal of Semiconductor Technology and Science
Issue number2
Publication statusPublished - 2017 Apr 1


All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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