Control of the electrical and adhesion properties of metal/organic interfaces with self-assembled monolayers

Jeong Ho Cho, Jung Ah Lim, Joong Tark Han, Ho Won Jang, Jong Lam Lee, Kilwon Cho

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With the aim of improving the electrical and adhesion properties of a noble-metal electrode (Ag)/organic interface, a SH-terminated self-assembled monolayer (SAM) that reacts with the silver atoms of the electrode was tested. Silver atoms deposited on the SH-modified surface were found to bind strongly to the terminal sulfur atoms as a result of the reaction between sulfur and silver. In contrast, silver atoms deposited onto a CH3 -modified surface do not react with the SAM. The specific contact resistance of the interface between the SH-terminated surface and the silver electrode (1.31× 10-2 Ω cm2) was found to be much lower than that of the silver thin film deposited on the CH3 -modified surface (495.58 Ω cm2).

Original languageEnglish
Article number171906
Pages (from-to)1-3
Number of pages3
JournalApplied Physics Letters
Issue number17
Publication statusPublished - 2005 Apr 25


All Science Journal Classification (ASJC) codes

  • Physics and Astronomy (miscellaneous)

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