With the aim of improving the electrical and adhesion properties of a noble-metal electrode (Ag)/organic interface, a SH-terminated self-assembled monolayer (SAM) that reacts with the silver atoms of the electrode was tested. Silver atoms deposited on the SH-modified surface were found to bind strongly to the terminal sulfur atoms as a result of the reaction between sulfur and silver. In contrast, silver atoms deposited onto a CH3 -modified surface do not react with the SAM. The specific contact resistance of the interface between the SH-terminated surface and the silver electrode (1.31× 10-2 Ω cm2) was found to be much lower than that of the silver thin film deposited on the CH3 -modified surface (495.58 Ω cm2).
Bibliographical noteFunding Information:
This work was supported by the Korea Research Foundation Grant No. (KRF-2004-0005-D00004).
All Science Journal Classification (ASJC) codes
- Physics and Astronomy (miscellaneous)