Abstract
With the aim of improving the electrical and adhesion properties of a noble-metal electrode (Ag)/organic interface, a SH-terminated self-assembled monolayer (SAM) that reacts with the silver atoms of the electrode was tested. Silver atoms deposited on the SH-modified surface were found to bind strongly to the terminal sulfur atoms as a result of the reaction between sulfur and silver. In contrast, silver atoms deposited onto a CH3 -modified surface do not react with the SAM. The specific contact resistance of the interface between the SH-terminated surface and the silver electrode (1.31× 10-2 Ω cm2) was found to be much lower than that of the silver thin film deposited on the CH3 -modified surface (495.58 Ω cm2).
| Original language | English |
|---|---|
| Article number | 171906 |
| Pages (from-to) | 1-3 |
| Number of pages | 3 |
| Journal | Applied Physics Letters |
| Volume | 86 |
| Issue number | 17 |
| DOIs | |
| Publication status | Published - 2005 Apr 25 |
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All Science Journal Classification (ASJC) codes
- Physics and Astronomy (miscellaneous)
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Control of the electrical and adhesion properties of metal/organic interfaces with self-assembled monolayers. / Cho, Jeong Ho; Lim, Jung Ah; Han, Joong Tark; Jang, Ho Won; Lee, Jong Lam; Cho, Kilwon.
In: Applied Physics Letters, Vol. 86, No. 17, 171906, 25.04.2005, p. 1-3.Research output: Contribution to journal › Article
TY - JOUR
T1 - Control of the electrical and adhesion properties of metal/organic interfaces with self-assembled monolayers
AU - Cho, Jeong Ho
AU - Lim, Jung Ah
AU - Han, Joong Tark
AU - Jang, Ho Won
AU - Lee, Jong Lam
AU - Cho, Kilwon
PY - 2005/4/25
Y1 - 2005/4/25
N2 - With the aim of improving the electrical and adhesion properties of a noble-metal electrode (Ag)/organic interface, a SH-terminated self-assembled monolayer (SAM) that reacts with the silver atoms of the electrode was tested. Silver atoms deposited on the SH-modified surface were found to bind strongly to the terminal sulfur atoms as a result of the reaction between sulfur and silver. In contrast, silver atoms deposited onto a CH3 -modified surface do not react with the SAM. The specific contact resistance of the interface between the SH-terminated surface and the silver electrode (1.31× 10-2 Ω cm2) was found to be much lower than that of the silver thin film deposited on the CH3 -modified surface (495.58 Ω cm2).
AB - With the aim of improving the electrical and adhesion properties of a noble-metal electrode (Ag)/organic interface, a SH-terminated self-assembled monolayer (SAM) that reacts with the silver atoms of the electrode was tested. Silver atoms deposited on the SH-modified surface were found to bind strongly to the terminal sulfur atoms as a result of the reaction between sulfur and silver. In contrast, silver atoms deposited onto a CH3 -modified surface do not react with the SAM. The specific contact resistance of the interface between the SH-terminated surface and the silver electrode (1.31× 10-2 Ω cm2) was found to be much lower than that of the silver thin film deposited on the CH3 -modified surface (495.58 Ω cm2).
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U2 - 10.1063/1.1914961
DO - 10.1063/1.1914961
M3 - Article
VL - 86
SP - 1
EP - 3
JO - Applied Physics Letters
JF - Applied Physics Letters
SN - 0003-6951
IS - 17
M1 - 171906
ER -