Control of the electrical and adhesion properties of metal/organic interfaces with self-assembled monolayers

Jeong Ho Cho; Jung Ah Lim; Joong Tark Han; Ho Won Jang; Jong Lam Lee; Kilwon Cho

doi:10.1063/1.1914961

Control of the electrical and adhesion properties of metal/organic interfaces with self-assembled monolayers

Jeong Ho Cho, Jung Ah Lim, Joong Tark Han, Ho Won Jang, Jong Lam Lee, Kilwon Cho

Department of Chemical and Biomolecular Engineering

Research output: Contribution to journal › Article

26 Citations (Scopus)

Abstract

With the aim of improving the electrical and adhesion properties of a noble-metal electrode (Ag)/organic interface, a SH-terminated self-assembled monolayer (SAM) that reacts with the silver atoms of the electrode was tested. Silver atoms deposited on the SH-modified surface were found to bind strongly to the terminal sulfur atoms as a result of the reaction between sulfur and silver. In contrast, silver atoms deposited onto a CH3 -modified surface do not react with the SAM. The specific contact resistance of the interface between the SH-terminated surface and the silver electrode (1.31× 10_-2 Ω cm₂) was found to be much lower than that of the silver thin film deposited on the CH3 -modified surface (495.58 Ω cm₂).

Original language	English
Article number	171906
Pages (from-to)	1-3
Number of pages	3
Journal	Applied Physics Letters
Volume	86
Issue number	17
DOIs	https://doi.org/10.1063/1.1914961
Publication status	Published - 2005 Apr 25

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All Science Journal Classification (ASJC) codes

Physics and Astronomy (miscellaneous)

Cite this

Cho, J. H., Lim, J. A., Han, J. T., Jang, H. W., Lee, J. L., & Cho, K. (2005). Control of the electrical and adhesion properties of metal/organic interfaces with self-assembled monolayers. Applied Physics Letters, 86(17), 1-3. [171906]. https://doi.org/10.1063/1.1914961

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10.1063/1.1914961