Abstract
With the aim of improving the electrical and adhesion properties of a noble-metal electrode (Ag)/organic interface, a SH-terminated self-assembled monolayer (SAM) that reacts with the silver atoms of the electrode was tested. Silver atoms deposited on the SH-modified surface were found to bind strongly to the terminal sulfur atoms as a result of the reaction between sulfur and silver. In contrast, silver atoms deposited onto a CH3 -modified surface do not react with the SAM. The specific contact resistance of the interface between the SH-terminated surface and the silver electrode (1.31× 10-2 Ω cm2) was found to be much lower than that of the silver thin film deposited on the CH3 -modified surface (495.58 Ω cm2).
Original language | English |
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Article number | 171906 |
Pages (from-to) | 1-3 |
Number of pages | 3 |
Journal | Applied Physics Letters |
Volume | 86 |
Issue number | 17 |
DOIs | |
Publication status | Published - 2005 Apr 25 |
Bibliographical note
Funding Information:This work was supported by the Korea Research Foundation Grant No. (KRF-2004-0005-D00004).
All Science Journal Classification (ASJC) codes
- Physics and Astronomy (miscellaneous)