Control of the electrical and adhesion properties of metal/organic interfaces with self-assembled monolayers

Jeong Ho Cho; Jung Ah Lim; Joong Tark Han; Ho Won Jang; Jong Lam Lee; Kilwon Cho

doi:10.1063/1.1914961

Control of the electrical and adhesion properties of metal/organic interfaces with self-assembled monolayers

Jeong Ho Cho, Jung Ah Lim, Joong Tark Han, Ho Won Jang, Jong Lam Lee, Kilwon Cho

Department of Chemical and Biomolecular Engineering

Research output: Contribution to journal › Article › peer-review

28 Citations (Scopus)

Abstract

With the aim of improving the electrical and adhesion properties of a noble-metal electrode (Ag)/organic interface, a SH-terminated self-assembled monolayer (SAM) that reacts with the silver atoms of the electrode was tested. Silver atoms deposited on the SH-modified surface were found to bind strongly to the terminal sulfur atoms as a result of the reaction between sulfur and silver. In contrast, silver atoms deposited onto a CH3 -modified surface do not react with the SAM. The specific contact resistance of the interface between the SH-terminated surface and the silver electrode (1.31× 10_-2 Ω cm₂) was found to be much lower than that of the silver thin film deposited on the CH3 -modified surface (495.58 Ω cm₂).

Original language	English
Article number	171906
Pages (from-to)	1-3
Number of pages	3
Journal	Applied Physics Letters
Volume	86
Issue number	17
DOIs	https://doi.org/10.1063/1.1914961
Publication status	Published - 2005 Apr 25

Bibliographical note

Funding Information:
This work was supported by the Korea Research Foundation Grant No. (KRF-2004-0005-D00004).

All Science Journal Classification (ASJC) codes

Physics and Astronomy (miscellaneous)

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10.1063/1.1914961

Cite this

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title = "Control of the electrical and adhesion properties of metal/organic interfaces with self-assembled monolayers",

abstract = "With the aim of improving the electrical and adhesion properties of a noble-metal electrode (Ag)/organic interface, a SH-terminated self-assembled monolayer (SAM) that reacts with the silver atoms of the electrode was tested. Silver atoms deposited on the SH-modified surface were found to bind strongly to the terminal sulfur atoms as a result of the reaction between sulfur and silver. In contrast, silver atoms deposited onto a CH3 -modified surface do not react with the SAM. The specific contact resistance of the interface between the SH-terminated surface and the silver electrode (1.31× 10-2 Ω cm2) was found to be much lower than that of the silver thin film deposited on the CH3 -modified surface (495.58 Ω cm2).",

author = "Cho, {Jeong Ho} and Lim, {Jung Ah} and Han, {Joong Tark} and Jang, {Ho Won} and Lee, {Jong Lam} and Kilwon Cho",

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AU - Cho, Jeong Ho

AU - Lim, Jung Ah

AU - Han, Joong Tark

AU - Jang, Ho Won

AU - Lee, Jong Lam

AU - Cho, Kilwon

N1 - Funding Information: This work was supported by the Korea Research Foundation Grant No. (KRF-2004-0005-D00004).

PY - 2005/4/25

Y1 - 2005/4/25

N2 - With the aim of improving the electrical and adhesion properties of a noble-metal electrode (Ag)/organic interface, a SH-terminated self-assembled monolayer (SAM) that reacts with the silver atoms of the electrode was tested. Silver atoms deposited on the SH-modified surface were found to bind strongly to the terminal sulfur atoms as a result of the reaction between sulfur and silver. In contrast, silver atoms deposited onto a CH3 -modified surface do not react with the SAM. The specific contact resistance of the interface between the SH-terminated surface and the silver electrode (1.31× 10-2 Ω cm2) was found to be much lower than that of the silver thin film deposited on the CH3 -modified surface (495.58 Ω cm2).

AB - With the aim of improving the electrical and adhesion properties of a noble-metal electrode (Ag)/organic interface, a SH-terminated self-assembled monolayer (SAM) that reacts with the silver atoms of the electrode was tested. Silver atoms deposited on the SH-modified surface were found to bind strongly to the terminal sulfur atoms as a result of the reaction between sulfur and silver. In contrast, silver atoms deposited onto a CH3 -modified surface do not react with the SAM. The specific contact resistance of the interface between the SH-terminated surface and the silver electrode (1.31× 10-2 Ω cm2) was found to be much lower than that of the silver thin film deposited on the CH3 -modified surface (495.58 Ω cm2).

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Control of the electrical and adhesion properties of metal/organic interfaces with self-assembled monolayers

Abstract

Bibliographical note

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