Control of the electrical and adhesion properties of metal/organic interfaces with self-assembled monolayers

Jeong Ho Cho, Jung Ah Lim, Joong Tark Han, Ho Won Jang, Jong Lam Lee, Kilwon Cho

Research output: Contribution to journalArticle

26 Citations (Scopus)

Abstract

With the aim of improving the electrical and adhesion properties of a noble-metal electrode (Ag)/organic interface, a SH-terminated self-assembled monolayer (SAM) that reacts with the silver atoms of the electrode was tested. Silver atoms deposited on the SH-modified surface were found to bind strongly to the terminal sulfur atoms as a result of the reaction between sulfur and silver. In contrast, silver atoms deposited onto a CH3 -modified surface do not react with the SAM. The specific contact resistance of the interface between the SH-terminated surface and the silver electrode (1.31× 10-2 Ω cm2) was found to be much lower than that of the silver thin film deposited on the CH3 -modified surface (495.58 Ω cm2).

Original languageEnglish
Article number171906
Pages (from-to)1-3
Number of pages3
JournalApplied Physics Letters
Volume86
Issue number17
DOIs
Publication statusPublished - 2005 Apr 25

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adhesion
electrical properties
silver
metals
atoms
electrodes
sulfur
contact resistance
noble metals
thin films

All Science Journal Classification (ASJC) codes

  • Physics and Astronomy (miscellaneous)

Cite this

Cho, Jeong Ho ; Lim, Jung Ah ; Han, Joong Tark ; Jang, Ho Won ; Lee, Jong Lam ; Cho, Kilwon. / Control of the electrical and adhesion properties of metal/organic interfaces with self-assembled monolayers. In: Applied Physics Letters. 2005 ; Vol. 86, No. 17. pp. 1-3.
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Control of the electrical and adhesion properties of metal/organic interfaces with self-assembled monolayers. / Cho, Jeong Ho; Lim, Jung Ah; Han, Joong Tark; Jang, Ho Won; Lee, Jong Lam; Cho, Kilwon.

In: Applied Physics Letters, Vol. 86, No. 17, 171906, 25.04.2005, p. 1-3.

Research output: Contribution to journalArticle

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