Control principles and on-chip circuits for active cooling using integrated superlattice-based thin-film thermoelectric devices

Borislav Alexandrov, Owen Sullivan, William J. Song, Sudhakar Yalamanchili, Satish Kumar, Saibal Mukhopadhyay

Research output: Contribution to journalArticle

4 Citations (Scopus)


Superlattice thin-film thermoelectric coolers (TECs) are emerging as a promising technology for hot spot mitigation in microprocessors. This paper studies the prospect of on-demand cooling with advanced TECs integrated at the back of the heat spreader inside a package (integrated TEC). Using thermal compact models of the chip and package with integrated TECs, the control principles for TEC-assisted transient cooling are presented. The control principles are implemented in a 130-nm CMOS process and cosimulated with the thermal system to show their feasibility and energy overheads. The simulation results show potential for extending the time for which a chip and package can sustain a high power load.

Original languageEnglish
Article number6595140
Pages (from-to)1909-1919
Number of pages11
JournalIEEE Transactions on Very Large Scale Integration (VLSI) Systems
Issue number9
Publication statusPublished - 2014 Sep


All Science Journal Classification (ASJC) codes

  • Software
  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this