Cordierite-based dielectric thick films on an oxidized copper layer: microstructural evidence of copper diffusion

Yong Soo Cho, David T. Hoelzer, Walter A. Schulze, Vasantha R.W. Amarakoon

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

Cordierite-based dielectric thick films deposited by screen-printing on a Cu2O-Cu-96% alumina substrate were investigated with regard to microstructural characteristics, densification, and crystallization. Compared to direct deposition of the cordierite layer on metal Cu, the use of the Cu2O layer as a diffusion barrier caused the cordierite thick film to become more stable without any significant interaction layer at the film interface after firing at 920°C for 30 min in a N2 atmosphere. On the other hand, microstructural observation of the cordierite thick films on the Cu2O revealed some evidence of Cu diffusion into the cordierite thick films, i.e., incorporation of Cu into the cordierite and remaining glass, and as Cu precipitates. Additionally, the diffused Cu was found to significantly affect densification and crystallization of the thick films, resulting in lower densification and crystallization temperatures. An XRD analysis supported the Cu incorporation from the Cu2O layer into the cordierite by showing the disappearance of Cu2O phase at 700°C, which is below densification temperature.

Original languageEnglish
Pages (from-to)1949-1952
Number of pages4
JournalJournal of the American Ceramic Society
Volume82
Issue number7
DOIs
Publication statusPublished - 1999 Jan 1

Fingerprint

Dielectric films
cordierite
Thick films
Copper
Densification
copper
Crystallization
crystallization
Diffusion barriers
Screen printing
Precipitates
Aluminum Oxide
Alumina
aluminum oxide
Glass
Temperature
glass
Metals
temperature
X-ray diffraction

All Science Journal Classification (ASJC) codes

  • Ceramics and Composites
  • Materials Chemistry

Cite this

Cho, Yong Soo ; Hoelzer, David T. ; Schulze, Walter A. ; Amarakoon, Vasantha R.W. / Cordierite-based dielectric thick films on an oxidized copper layer : microstructural evidence of copper diffusion. In: Journal of the American Ceramic Society. 1999 ; Vol. 82, No. 7. pp. 1949-1952.
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abstract = "Cordierite-based dielectric thick films deposited by screen-printing on a Cu2O-Cu-96{\%} alumina substrate were investigated with regard to microstructural characteristics, densification, and crystallization. Compared to direct deposition of the cordierite layer on metal Cu, the use of the Cu2O layer as a diffusion barrier caused the cordierite thick film to become more stable without any significant interaction layer at the film interface after firing at 920°C for 30 min in a N2 atmosphere. On the other hand, microstructural observation of the cordierite thick films on the Cu2O revealed some evidence of Cu diffusion into the cordierite thick films, i.e., incorporation of Cu into the cordierite and remaining glass, and as Cu precipitates. Additionally, the diffused Cu was found to significantly affect densification and crystallization of the thick films, resulting in lower densification and crystallization temperatures. An XRD analysis supported the Cu incorporation from the Cu2O layer into the cordierite by showing the disappearance of Cu2O phase at 700°C, which is below densification temperature.",
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Cordierite-based dielectric thick films on an oxidized copper layer : microstructural evidence of copper diffusion. / Cho, Yong Soo; Hoelzer, David T.; Schulze, Walter A.; Amarakoon, Vasantha R.W.

In: Journal of the American Ceramic Society, Vol. 82, No. 7, 01.01.1999, p. 1949-1952.

Research output: Contribution to journalArticle

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T2 - microstructural evidence of copper diffusion

AU - Cho, Yong Soo

AU - Hoelzer, David T.

AU - Schulze, Walter A.

AU - Amarakoon, Vasantha R.W.

PY - 1999/1/1

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