Coupled self-assembled monolayer for enhancement of Cu diffusion barrier and adhesion properties

Yongwon Chung, Sanggeun Lee, Chandreswar Mahata, Jungmok Seo, Seung Min Lim, Min Su Jeong, Hanearl Jung, Young Chang Joo, Young Bae Park, Hyungjun Kim, Taeyoon Lee

Research output: Contribution to journalArticle

7 Citations (Scopus)

Abstract

In this work, we have demonstrated chemically coupled (3-aminopropyl)trimethoxysilane (APTMS) and 3-mercaptopropionic acid (MPA) self-assembled monolayers (SAMs) to enhance the diffusion barrier properties against copper (Cu) as well as the adhesion properties towards SiO2 and Cu electrode. The coupled-SAM (C-SAM) can attach to both Cu and SiO2 strongly which is expected to enhance both the diffusion barrier and adhesion properties. A carbodiimide-mediated amidation process was used to link NH2 terminated APTMS to COOH terminated MPA. The resulting C-SAM shows a low root-mean-square roughness of 0.44 nm and a thickness of 2 nm. Time-dependent dielectric breakdown (TDDB) tests are used to evaluate APTMS and C-SAM for their ability to block Cu ion diffusion. The average time-tofailure (TTF) is enhanced over 4 times after the MPA attachment, and is even comparable to TaN barriers. Capacitance-voltage (C-V) measurements are also conducted to monitor Cu ion diffusion. Negligible change in the flatband voltage and C-V curve is observed during the constant voltage stress C-V measurement. Enhancement of the adhesion properties are measured using four-point bending tests and shows that the C-SAM has a 33% enhancement in the adhesion properties between SiO2 and Cu compared to APTMS. The C-SAM shows potential as an ultra-thin Cu diffusion barrier which also has good adhesion properties.

Original languageEnglish
Pages (from-to)60123-60130
Number of pages8
JournalRSC Advances
Volume4
Issue number104
DOIs
Publication statusPublished - 2014

Fingerprint

Diffusion barriers
Self assembled monolayers
Adhesion
Capacitance measurement
Voltage measurement
Acids
Electric potential
3-Mercaptopropionic Acid
Ions
Carbodiimides
Bending tests
Electric breakdown
Copper
Capacitance
Surface roughness
Electrodes
3-aminopropyltrimethoxysilane

All Science Journal Classification (ASJC) codes

  • Chemistry(all)
  • Chemical Engineering(all)

Cite this

Chung, Yongwon ; Lee, Sanggeun ; Mahata, Chandreswar ; Seo, Jungmok ; Lim, Seung Min ; Jeong, Min Su ; Jung, Hanearl ; Joo, Young Chang ; Park, Young Bae ; Kim, Hyungjun ; Lee, Taeyoon. / Coupled self-assembled monolayer for enhancement of Cu diffusion barrier and adhesion properties. In: RSC Advances. 2014 ; Vol. 4, No. 104. pp. 60123-60130.
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abstract = "In this work, we have demonstrated chemically coupled (3-aminopropyl)trimethoxysilane (APTMS) and 3-mercaptopropionic acid (MPA) self-assembled monolayers (SAMs) to enhance the diffusion barrier properties against copper (Cu) as well as the adhesion properties towards SiO2 and Cu electrode. The coupled-SAM (C-SAM) can attach to both Cu and SiO2 strongly which is expected to enhance both the diffusion barrier and adhesion properties. A carbodiimide-mediated amidation process was used to link NH2 terminated APTMS to COOH terminated MPA. The resulting C-SAM shows a low root-mean-square roughness of 0.44 nm and a thickness of 2 nm. Time-dependent dielectric breakdown (TDDB) tests are used to evaluate APTMS and C-SAM for their ability to block Cu ion diffusion. The average time-tofailure (TTF) is enhanced over 4 times after the MPA attachment, and is even comparable to TaN barriers. Capacitance-voltage (C-V) measurements are also conducted to monitor Cu ion diffusion. Negligible change in the flatband voltage and C-V curve is observed during the constant voltage stress C-V measurement. Enhancement of the adhesion properties are measured using four-point bending tests and shows that the C-SAM has a 33{\%} enhancement in the adhesion properties between SiO2 and Cu compared to APTMS. The C-SAM shows potential as an ultra-thin Cu diffusion barrier which also has good adhesion properties.",
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Chung, Y, Lee, S, Mahata, C, Seo, J, Lim, SM, Jeong, MS, Jung, H, Joo, YC, Park, YB, Kim, H & Lee, T 2014, 'Coupled self-assembled monolayer for enhancement of Cu diffusion barrier and adhesion properties', RSC Advances, vol. 4, no. 104, pp. 60123-60130. https://doi.org/10.1039/c4ra08134j

Coupled self-assembled monolayer for enhancement of Cu diffusion barrier and adhesion properties. / Chung, Yongwon; Lee, Sanggeun; Mahata, Chandreswar; Seo, Jungmok; Lim, Seung Min; Jeong, Min Su; Jung, Hanearl; Joo, Young Chang; Park, Young Bae; Kim, Hyungjun; Lee, Taeyoon.

In: RSC Advances, Vol. 4, No. 104, 2014, p. 60123-60130.

Research output: Contribution to journalArticle

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T1 - Coupled self-assembled monolayer for enhancement of Cu diffusion barrier and adhesion properties

AU - Chung, Yongwon

AU - Lee, Sanggeun

AU - Mahata, Chandreswar

AU - Seo, Jungmok

AU - Lim, Seung Min

AU - Jeong, Min Su

AU - Jung, Hanearl

AU - Joo, Young Chang

AU - Park, Young Bae

AU - Kim, Hyungjun

AU - Lee, Taeyoon

PY - 2014

Y1 - 2014

N2 - In this work, we have demonstrated chemically coupled (3-aminopropyl)trimethoxysilane (APTMS) and 3-mercaptopropionic acid (MPA) self-assembled monolayers (SAMs) to enhance the diffusion barrier properties against copper (Cu) as well as the adhesion properties towards SiO2 and Cu electrode. The coupled-SAM (C-SAM) can attach to both Cu and SiO2 strongly which is expected to enhance both the diffusion barrier and adhesion properties. A carbodiimide-mediated amidation process was used to link NH2 terminated APTMS to COOH terminated MPA. The resulting C-SAM shows a low root-mean-square roughness of 0.44 nm and a thickness of 2 nm. Time-dependent dielectric breakdown (TDDB) tests are used to evaluate APTMS and C-SAM for their ability to block Cu ion diffusion. The average time-tofailure (TTF) is enhanced over 4 times after the MPA attachment, and is even comparable to TaN barriers. Capacitance-voltage (C-V) measurements are also conducted to monitor Cu ion diffusion. Negligible change in the flatband voltage and C-V curve is observed during the constant voltage stress C-V measurement. Enhancement of the adhesion properties are measured using four-point bending tests and shows that the C-SAM has a 33% enhancement in the adhesion properties between SiO2 and Cu compared to APTMS. The C-SAM shows potential as an ultra-thin Cu diffusion barrier which also has good adhesion properties.

AB - In this work, we have demonstrated chemically coupled (3-aminopropyl)trimethoxysilane (APTMS) and 3-mercaptopropionic acid (MPA) self-assembled monolayers (SAMs) to enhance the diffusion barrier properties against copper (Cu) as well as the adhesion properties towards SiO2 and Cu electrode. The coupled-SAM (C-SAM) can attach to both Cu and SiO2 strongly which is expected to enhance both the diffusion barrier and adhesion properties. A carbodiimide-mediated amidation process was used to link NH2 terminated APTMS to COOH terminated MPA. The resulting C-SAM shows a low root-mean-square roughness of 0.44 nm and a thickness of 2 nm. Time-dependent dielectric breakdown (TDDB) tests are used to evaluate APTMS and C-SAM for their ability to block Cu ion diffusion. The average time-tofailure (TTF) is enhanced over 4 times after the MPA attachment, and is even comparable to TaN barriers. Capacitance-voltage (C-V) measurements are also conducted to monitor Cu ion diffusion. Negligible change in the flatband voltage and C-V curve is observed during the constant voltage stress C-V measurement. Enhancement of the adhesion properties are measured using four-point bending tests and shows that the C-SAM has a 33% enhancement in the adhesion properties between SiO2 and Cu compared to APTMS. The C-SAM shows potential as an ultra-thin Cu diffusion barrier which also has good adhesion properties.

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