Cu-incorporation by melt-spinning in n-type Bi                         2                         Te                         2.7                         Se                         0.3                          alloys for low-temperature power generation

Minyoung Kim; Sang il Kim; Hyun joon Cho; Hyuna Mun; Hyun sik Kim; Jae Hong Lim; Sung Wng Kim; Kyu Hyoung Lee

doi:10.1016/j.scriptamat.2019.04.006

Cu-incorporation by melt-spinning in n-type Bi ₂ Te _2.7 Se _0.3 alloys for low-temperature power generation

Minyoung Kim, Sang il Kim, Hyun joon Cho, Hyuna Mun, Hyun sik Kim, Jae Hong Lim, Sung Wng Kim, Kyu Hyoung Lee

Department of Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

9 Citations (Scopus)

Abstract

Herein, we report the enhanced thermoelectric performance of Cu incorporated Bi ₂ Te _2.7 Se _0.3 prepared by melt spinning. The electronic transport properties were significantly improved by Cu incorporation due to the synergetic effect of carrier tuning, band modification, and electron-phonon transport control. The steady dimensionless thermoelectric figure of merit higher than 0.90 was achieved in the wide range of temperature range of 350–450 K for Cu _0.008 Bi ₂ Te _2.7 Se _0.3 , which is ~30% enhancement in comparison with pristine Bi ₂ Te _2.7 Se _0.3 . This result can lead to high thermoelectric power generation efficiency 4.2% at ΔT = 180 K.

Original language	English
Pages (from-to)	120-125
Number of pages	6
Journal	Scripta Materialia
Volume	167
DOIs	https://doi.org/10.1016/j.scriptamat.2019.04.006
Publication status	Published - 2019 Jul 1

Bibliographical note

Funding Information:
This work was supported by Samsung Research Funding & Incubation Center of Samsung Electronics under Project Number SRFC-MA1701-05 .

Publisher Copyright:
© 2019 Elsevier Ltd

All Science Journal Classification (ASJC) codes

Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering
Metals and Alloys

Access to Document

10.1016/j.scriptamat.2019.04.006

Cite this

Kim, M., Kim, S. I., Cho, H. J., Mun, H., Kim, H. S., Lim, J. H., Kim, S. W., & Lee, K. H. (2019). Cu-incorporation by melt-spinning in n-type Bi ₂ Te _2.7 Se _0.3 alloys for low-temperature power generation Scripta Materialia, 167, 120-125. https://doi.org/10.1016/j.scriptamat.2019.04.006

Kim, Minyoung ; Kim, Sang il ; Cho, Hyun joon et al. / Cu-incorporation by melt-spinning in n-type Bi ₂ Te _2.7 Se _0.3 alloys for low-temperature power generation In: Scripta Materialia. 2019 ; Vol. 167. pp. 120-125.

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title = " Cu-incorporation by melt-spinning in n-type Bi 2 Te 2.7 Se 0.3 alloys for low-temperature power generation ",

abstract = " Herein, we report the enhanced thermoelectric performance of Cu incorporated Bi 2 Te 2.7 Se 0.3 prepared by melt spinning. The electronic transport properties were significantly improved by Cu incorporation due to the synergetic effect of carrier tuning, band modification, and electron-phonon transport control. The steady dimensionless thermoelectric figure of merit higher than 0.90 was achieved in the wide range of temperature range of 350–450 K for Cu 0.008 Bi 2 Te 2.7 Se 0.3 , which is ~30% enhancement in comparison with pristine Bi 2 Te 2.7 Se 0.3 . This result can lead to high thermoelectric power generation efficiency 4.2% at ΔT = 180 K.",

author = "Minyoung Kim and Kim, {Sang il} and Cho, {Hyun joon} and Hyuna Mun and Kim, {Hyun sik} and Lim, {Jae Hong} and Kim, {Sung Wng} and Lee, {Kyu Hyoung}",

note = "Funding Information: This work was supported by Samsung Research Funding & Incubation Center of Samsung Electronics under Project Number SRFC-MA1701-05 . Publisher Copyright: {\textcopyright} 2019 Elsevier Ltd",

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doi = "10.1016/j.scriptamat.2019.04.006",

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Kim, M, Kim, SI, Cho, HJ, Mun, H, Kim, HS, Lim, JH, Kim, SW & Lee, KH 2019, ' Cu-incorporation by melt-spinning in n-type Bi ₂ Te _2.7 Se _0.3 alloys for low-temperature power generation ', Scripta Materialia, vol. 167, pp. 120-125. https://doi.org/10.1016/j.scriptamat.2019.04.006

Cu-incorporation by melt-spinning in n-type Bi ₂ Te _2.7 Se _0.3 alloys for low-temperature power generation . / Kim, Minyoung; Kim, Sang il; Cho, Hyun joon et al.

In: Scripta Materialia, Vol. 167, 01.07.2019, p. 120-125.

Research output: Contribution to journal › Article › peer-review

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T1 - Cu-incorporation by melt-spinning in n-type Bi 2 Te 2.7 Se 0.3 alloys for low-temperature power generation

AU - Kim, Minyoung

AU - Kim, Sang il

AU - Cho, Hyun joon

AU - Mun, Hyuna

AU - Kim, Hyun sik

AU - Lim, Jae Hong

AU - Kim, Sung Wng

AU - Lee, Kyu Hyoung

PY - 2019/7/1

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N2 - Herein, we report the enhanced thermoelectric performance of Cu incorporated Bi 2 Te 2.7 Se 0.3 prepared by melt spinning. The electronic transport properties were significantly improved by Cu incorporation due to the synergetic effect of carrier tuning, band modification, and electron-phonon transport control. The steady dimensionless thermoelectric figure of merit higher than 0.90 was achieved in the wide range of temperature range of 350–450 K for Cu 0.008 Bi 2 Te 2.7 Se 0.3 , which is ~30% enhancement in comparison with pristine Bi 2 Te 2.7 Se 0.3 . This result can lead to high thermoelectric power generation efficiency 4.2% at ΔT = 180 K.

AB - Herein, we report the enhanced thermoelectric performance of Cu incorporated Bi 2 Te 2.7 Se 0.3 prepared by melt spinning. The electronic transport properties were significantly improved by Cu incorporation due to the synergetic effect of carrier tuning, band modification, and electron-phonon transport control. The steady dimensionless thermoelectric figure of merit higher than 0.90 was achieved in the wide range of temperature range of 350–450 K for Cu 0.008 Bi 2 Te 2.7 Se 0.3 , which is ~30% enhancement in comparison with pristine Bi 2 Te 2.7 Se 0.3 . This result can lead to high thermoelectric power generation efficiency 4.2% at ΔT = 180 K.

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Kim M, Kim SI, Cho HJ, Mun H, Kim HS, Lim JH et al. Cu-incorporation by melt-spinning in n-type Bi ₂ Te _2.7 Se _0.3 alloys for low-temperature power generation Scripta Materialia. 2019 Jul 1;167:120-125. doi: 10.1016/j.scriptamat.2019.04.006