TY - GEN
T1 - Deflection routing in 3D Network-on-Chip with TSV serialization
AU - Lee, Jinho
AU - Lee, Dongwoo
AU - Kim, Sunwook
AU - Choi, Kiyoung
N1 - Copyright:
Copyright 2013 Elsevier B.V., All rights reserved.
PY - 2013
Y1 - 2013
N2 - This paper proposes a deflection routing for 3D NoC with serialized TSVs. Bufferless deflection routing provides area- and power-efficient communication under low to medium traffic load. Under 3D circumstances, the bufferless deflection routing can yield even better performance than buffered routing when key aspects are properly taken into account. Evaluation of the proposed scheme shows its effectiveness in throughput, latency, and energy consumption.
AB - This paper proposes a deflection routing for 3D NoC with serialized TSVs. Bufferless deflection routing provides area- and power-efficient communication under low to medium traffic load. Under 3D circumstances, the bufferless deflection routing can yield even better performance than buffered routing when key aspects are properly taken into account. Evaluation of the proposed scheme shows its effectiveness in throughput, latency, and energy consumption.
UR - http://www.scopus.com/inward/record.url?scp=84877763733&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84877763733&partnerID=8YFLogxK
U2 - 10.1109/ASPDAC.2013.6509554
DO - 10.1109/ASPDAC.2013.6509554
M3 - Conference contribution
AN - SCOPUS:84877763733
SN - 9781467330299
T3 - Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC
SP - 29
EP - 34
BT - 2013 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013
T2 - 2013 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013
Y2 - 22 January 2013 through 25 January 2013
ER -