Deflection routing in 3D Network-on-Chip with TSV serialization

Jinho Lee; Dongwoo Lee; Sunwook Kim; Kiyoung Choi

doi:10.1109/ASPDAC.2013.6509554

Deflection routing in 3D Network-on-Chip with TSV serialization

Jinho Lee, Dongwoo Lee, Sunwook Kim, Kiyoung Choi

Department of Computer Science

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

9 Citations (Scopus)

Abstract

This paper proposes a deflection routing for 3D NoC with serialized TSVs. Bufferless deflection routing provides area- and power-efficient communication under low to medium traffic load. Under 3D circumstances, the bufferless deflection routing can yield even better performance than buffered routing when key aspects are properly taken into account. Evaluation of the proposed scheme shows its effectiveness in throughput, latency, and energy consumption.

Original language	English
Title of host publication	2013 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013
Pages	29-34
Number of pages	6
DOIs	https://doi.org/10.1109/ASPDAC.2013.6509554
Publication status	Published - 2013 May 20
Event	2013 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013 - Yokohama, Japan Duration: 2013 Jan 22 → 2013 Jan 25

Publication series

Name	Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC

Conference

Conference	2013 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013
Country	Japan
City	Yokohama
Period	13/1/22 → 13/1/25

All Science Journal Classification (ASJC) codes

Computer Science Applications
Computer Graphics and Computer-Aided Design
Electrical and Electronic Engineering

Access to Document

10.1109/ASPDAC.2013.6509554

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Cite this

Lee, J., Lee, D., Kim, S., & Choi, K. (2013). Deflection routing in 3D Network-on-Chip with TSV serialization. In 2013 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013 (pp. 29-34). [6509554] (Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC). https://doi.org/10.1109/ASPDAC.2013.6509554

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abstract = "This paper proposes a deflection routing for 3D NoC with serialized TSVs. Bufferless deflection routing provides area- and power-efficient communication under low to medium traffic load. Under 3D circumstances, the bufferless deflection routing can yield even better performance than buffered routing when key aspects are properly taken into account. Evaluation of the proposed scheme shows its effectiveness in throughput, latency, and energy consumption.",

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Lee, J, Lee, D, Kim, S & Choi, K 2013, Deflection routing in 3D Network-on-Chip with TSV serialization. in 2013 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013., 6509554, Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC, pp. 29-34, 2013 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013, Yokohama, Japan, 13/1/22. https://doi.org/10.1109/ASPDAC.2013.6509554

Deflection routing in 3D Network-on-Chip with TSV serialization. / Lee, Jinho; Lee, Dongwoo; Kim, Sunwook; Choi, Kiyoung.

2013 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013. 2013. p. 29-34 6509554 (Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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