Deflection routing in 3D Network-on-Chip with TSV serialization

Jinho Lee, Dongwoo Lee, Sunwook Kim, Kiyoung Choi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

9 Citations (Scopus)

Abstract

This paper proposes a deflection routing for 3D NoC with serialized TSVs. Bufferless deflection routing provides area- and power-efficient communication under low to medium traffic load. Under 3D circumstances, the bufferless deflection routing can yield even better performance than buffered routing when key aspects are properly taken into account. Evaluation of the proposed scheme shows its effectiveness in throughput, latency, and energy consumption.

Original languageEnglish
Title of host publication2013 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013
Pages29-34
Number of pages6
DOIs
Publication statusPublished - 2013 May 20
Event2013 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013 - Yokohama, Japan
Duration: 2013 Jan 222013 Jan 25

Publication series

NameProceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC

Conference

Conference2013 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013
CountryJapan
CityYokohama
Period13/1/2213/1/25

All Science Journal Classification (ASJC) codes

  • Computer Science Applications
  • Computer Graphics and Computer-Aided Design
  • Electrical and Electronic Engineering

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  • Cite this

    Lee, J., Lee, D., Kim, S., & Choi, K. (2013). Deflection routing in 3D Network-on-Chip with TSV serialization. In 2013 18th Asia and South Pacific Design Automation Conference, ASP-DAC 2013 (pp. 29-34). [6509554] (Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC). https://doi.org/10.1109/ASPDAC.2013.6509554