Deformable Electronics: Conducting Polymer Dough for Deformable Electronics (Adv. Mater. 22/2016)

Oh Jin Young, Sunghee Kim, Hong Koo Baik, Unyong Jeong

Research output: Contribution to journal › Comment/debate › peer-review

9 Citations (Scopus)

All Science Journal Classification (ASJC) codes

@article{29d0f510c9be44a68d63807365a9359f,

title = "Deformable Electronics: Conducting Polymer Dough for Deformable Electronics (Adv. Mater. 22/2016)",

author = "{Jin Young}, Oh and Sunghee Kim and Baik, {Hong Koo} and Unyong Jeong",

year = "2016",

month = jun,

day = "8",

doi = "10.1002/adma.201670155",

language = "English",

volume = "28",

pages = "4564",

journal = "Advanced Materials",

issn = "0935-9648",

publisher = "Wiley-VCH Verlag",

number = "22",

}

TY - JOUR

T1 - Deformable Electronics

T2 - Conducting Polymer Dough for Deformable Electronics (Adv. Mater. 22/2016)

AU - Jin Young, Oh

AU - Kim, Sunghee

AU - Baik, Hong Koo

AU - Jeong, Unyong

PY - 2016/6/8

Y1 - 2016/6/8

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U2 - 10.1002/adma.201670155

DO - 10.1002/adma.201670155

M3 - Comment/debate

AN - SCOPUS:84973106792

VL - 28

SP - 4564

JO - Advanced Materials

JF - Advanced Materials

SN - 0935-9648

IS - 22

ER -