Design & parameter optimization of flip-chip bonder

Hyoungsub Shim, Heuiseok Kang, Hoon Jeong, Youngjune Cho, Wansoo Kim, Shinill Kang

Research output: Contribution to journalConference article

Abstract

Bare-chip packaging becomes more popular along with the miniaturization of IT components. In this paper, we have studied flip-chip process, and developed automated bonding system. Among the several bonding method, NCP bonding is chosen and batch-type equipment is manufactured. The dual optics and vision system aligns the chip with the substrate. The bonding head equipped with temperature and force controllers bonds the chip. The system can be easily modified for other bonding methods such as ACF. In bonding process, the bonding force and temperature are known as the most dominant bonding parameters. A parametric study is performed for these two parameters. For the test sample, we used standard flip-chip test kit which consists of FR4 boards and dummy flip-chips. The bonding temperatures are chosen between 25°C to 300°C. The bonding forces are chosen between 5N and 300N. To test the bonding strength, a bonding strength tester was designed and constructed. After the bonding strength test, the samples are examined by microscope to determine the failure mode. The relations between the bonding strength and the bonding parameters are analyzed and compared with bonding models. Finally, the most suitable bonding condition is suggested in terms of temperature and force.

Original languageEnglish
Article number60480G
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume6048
DOIs
Publication statusPublished - 2005 Dec 1
EventOptomechatronic Actuators and Manipulation - Sappora, Japan
Duration: 2005 Dec 52005 Dec 7

Fingerprint

Flip chip
Parameter Optimization
chips
optimization
Chip
Failure Mode
Packaging
Vision System
Microscope
Batch
Two Parameters
Optics
Substrate
Controller
Design
Temperature
dummies
kits
temperature

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

Cite this

Shim, Hyoungsub ; Kang, Heuiseok ; Jeong, Hoon ; Cho, Youngjune ; Kim, Wansoo ; Kang, Shinill. / Design & parameter optimization of flip-chip bonder. In: Proceedings of SPIE - The International Society for Optical Engineering. 2005 ; Vol. 6048.
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Design & parameter optimization of flip-chip bonder. / Shim, Hyoungsub; Kang, Heuiseok; Jeong, Hoon; Cho, Youngjune; Kim, Wansoo; Kang, Shinill.

In: Proceedings of SPIE - The International Society for Optical Engineering, Vol. 6048, 60480G, 01.12.2005.

Research output: Contribution to journalConference article

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