Design and fabrication of a novel Bimorph microoptomechanical sensor

Si Hyung Lim; Jongeun Choi; Roberto Horowitz; Arunava Majumdar

doi:10.1109/JMEMS.2005.845446

Design and fabrication of a novel Bimorph microoptomechanical sensor

Si Hyung Lim, Jongeun Choi, Roberto Horowitz, Arunava Majumdar

Department of Mechanical Engineering

Research output: Contribution to journal › Article › peer-review

42 Citations (Scopus)

Abstract

We have designed a so-called flip-over bimaterial (FOB) beam to increase the sensitivity of micromechanical structures for sensing temperature and surface stress changes. The FOB beam has a configuration such that a material layer coats the top and bottom of the second material at different regions along the beam length. By multiple interconnections of FOB beams, the deflection or sensitivity can be amplified, and the out-of-plane motion of a sensing structure can be achieved. The FOB beam has 53% higher thermomechanical sensitivity than a conventional one. Using the FOB beam design, we have developed a microoptomechanical sensor having a symmetric structure such that beam deflection is converted into a linear displacement of a reflecting surface, which is used for optical interferometry. The designed sensor has been fabricated by surface micromachining techniques using a transparent quartz substrate for optical measurement. Within a sensor area of 100 μm × 100 μm, the thermomechanical sensitivity S_T = 180 nm/K was experimentally obtained.

Original language	English
Pages (from-to)	683-690
Number of pages	8
Journal	Journal of Microelectromechanical Systems
Volume	14
Issue number	4
DOIs	https://doi.org/10.1109/JMEMS.2005.845446
Publication status	Published - 2005 Aug

Bibliographical note

Funding Information:
Manuscript received August 18, 2004; revised November 11, 2004. This work was supported by the Department of Energy Environmental Management Science Program (DOE-EMSP). Subject Editor E. Obermeier. The authors are with the Department of Mechanical Engineering, University of California, Berkeley, CA 94720 USA (e-mail: majumdar@me.berkeley.edu). Digital Object Identifier 10.1109/JMEMS.2005.845446

All Science Journal Classification (ASJC) codes

Mechanical Engineering
Electrical and Electronic Engineering

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abstract = "We have designed a so-called flip-over bimaterial (FOB) beam to increase the sensitivity of micromechanical structures for sensing temperature and surface stress changes. The FOB beam has a configuration such that a material layer coats the top and bottom of the second material at different regions along the beam length. By multiple interconnections of FOB beams, the deflection or sensitivity can be amplified, and the out-of-plane motion of a sensing structure can be achieved. The FOB beam has 53% higher thermomechanical sensitivity than a conventional one. Using the FOB beam design, we have developed a microoptomechanical sensor having a symmetric structure such that beam deflection is converted into a linear displacement of a reflecting surface, which is used for optical interferometry. The designed sensor has been fabricated by surface micromachining techniques using a transparent quartz substrate for optical measurement. Within a sensor area of 100 μm × 100 μm, the thermomechanical sensitivity ST = 180 nm/K was experimentally obtained.",

author = "Lim, {Si Hyung} and Jongeun Choi and Roberto Horowitz and Arunava Majumdar",

note = "Funding Information: Manuscript received August 18, 2004; revised November 11, 2004. This work was supported by the Department of Energy Environmental Management Science Program (DOE-EMSP). Subject Editor E. Obermeier. The authors are with the Department of Mechanical Engineering, University of California, Berkeley, CA 94720 USA (e-mail: majumdar@me.berkeley.edu). Digital Object Identifier 10.1109/JMEMS.2005.845446",

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AU - Choi, Jongeun

AU - Horowitz, Roberto

AU - Majumdar, Arunava

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Design and fabrication of a novel Bimorph microoptomechanical sensor

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