Design and fabrication of metal PCB based on the patterned anodizing for improving thermal dissipation of LED lighting

Moon Ho Lee, Tae Jin Lee, Hye Jin Lee, Young Joo Kim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Abstract

The improvement of thermal efficiency in the light emitting diode (LED) is one of challenging topics for the wide use of high brightness LED since the excessive heat generated in the LED junction may result in the thermally induced optical and mechanical failures. To enhance thermal reliability of high brightness LED lighting, it is important to not only use components with high thermal conductivity in LED package but also improve thermal flow to the heat sink through the metal print circuit board (MPCB) where bad thermal efficiency is caused by dielectric layer with lower thermal conductivity. This study focuses on the design and fabrication of the new structure of metal PCB based on the patterned anodizing to improve thermal dissipation. The patterned anodizing makes it possible to connect the lead frame of LED package to the metal substrate directly without any thermal loss through the dielectric layer. Thus, more efficient thermal management is expected in newly designed MPCB since total thermal resistance can be reduced. In this paper, we will be present the findings, which have been resulted from thermal simulation and measurement to demonstrate the thermal performance of newly designed MPCB.

Original languageEnglish
Title of host publicationInternational Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings
DOIs
Publication statusPublished - 2010 Dec 1
Event2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference - Taipei, Taiwan, Province of China
Duration: 2010 Oct 202010 Oct 22

Publication series

NameInternational Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings

Other

Other2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference
CountryTaiwan, Province of China
CityTaipei
Period10/10/2010/10/22

Fingerprint

Anodic oxidation
Polychlorinated biphenyls
Light emitting diodes
Lighting
Fabrication
Metals
Networks (circuits)
Luminance
Thermal conductivity
Hot Temperature
Heat sinks
Heat resistance
Temperature control
Lead
Substrates

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Lee, M. H., Lee, T. J., Lee, H. J., & Kim, Y. J. (2010). Design and fabrication of metal PCB based on the patterned anodizing for improving thermal dissipation of LED lighting. In International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings [5699479] (International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings). https://doi.org/10.1109/IMPACT.2010.5699479
Lee, Moon Ho ; Lee, Tae Jin ; Lee, Hye Jin ; Kim, Young Joo. / Design and fabrication of metal PCB based on the patterned anodizing for improving thermal dissipation of LED lighting. International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings. 2010. (International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings).
@inproceedings{d28099a8ac204de5a3fcc8a98b24d0e4,
title = "Design and fabrication of metal PCB based on the patterned anodizing for improving thermal dissipation of LED lighting",
abstract = "The improvement of thermal efficiency in the light emitting diode (LED) is one of challenging topics for the wide use of high brightness LED since the excessive heat generated in the LED junction may result in the thermally induced optical and mechanical failures. To enhance thermal reliability of high brightness LED lighting, it is important to not only use components with high thermal conductivity in LED package but also improve thermal flow to the heat sink through the metal print circuit board (MPCB) where bad thermal efficiency is caused by dielectric layer with lower thermal conductivity. This study focuses on the design and fabrication of the new structure of metal PCB based on the patterned anodizing to improve thermal dissipation. The patterned anodizing makes it possible to connect the lead frame of LED package to the metal substrate directly without any thermal loss through the dielectric layer. Thus, more efficient thermal management is expected in newly designed MPCB since total thermal resistance can be reduced. In this paper, we will be present the findings, which have been resulted from thermal simulation and measurement to demonstrate the thermal performance of newly designed MPCB.",
author = "Lee, {Moon Ho} and Lee, {Tae Jin} and Lee, {Hye Jin} and Kim, {Young Joo}",
year = "2010",
month = "12",
day = "1",
doi = "10.1109/IMPACT.2010.5699479",
language = "English",
isbn = "9781424497836",
series = "International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings",
booktitle = "International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings",

}

Lee, MH, Lee, TJ, Lee, HJ & Kim, YJ 2010, Design and fabrication of metal PCB based on the patterned anodizing for improving thermal dissipation of LED lighting. in International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings., 5699479, International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings, 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Taipei, Taiwan, Province of China, 10/10/20. https://doi.org/10.1109/IMPACT.2010.5699479

Design and fabrication of metal PCB based on the patterned anodizing for improving thermal dissipation of LED lighting. / Lee, Moon Ho; Lee, Tae Jin; Lee, Hye Jin; Kim, Young Joo.

International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings. 2010. 5699479 (International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

TY - GEN

T1 - Design and fabrication of metal PCB based on the patterned anodizing for improving thermal dissipation of LED lighting

AU - Lee, Moon Ho

AU - Lee, Tae Jin

AU - Lee, Hye Jin

AU - Kim, Young Joo

PY - 2010/12/1

Y1 - 2010/12/1

N2 - The improvement of thermal efficiency in the light emitting diode (LED) is one of challenging topics for the wide use of high brightness LED since the excessive heat generated in the LED junction may result in the thermally induced optical and mechanical failures. To enhance thermal reliability of high brightness LED lighting, it is important to not only use components with high thermal conductivity in LED package but also improve thermal flow to the heat sink through the metal print circuit board (MPCB) where bad thermal efficiency is caused by dielectric layer with lower thermal conductivity. This study focuses on the design and fabrication of the new structure of metal PCB based on the patterned anodizing to improve thermal dissipation. The patterned anodizing makes it possible to connect the lead frame of LED package to the metal substrate directly without any thermal loss through the dielectric layer. Thus, more efficient thermal management is expected in newly designed MPCB since total thermal resistance can be reduced. In this paper, we will be present the findings, which have been resulted from thermal simulation and measurement to demonstrate the thermal performance of newly designed MPCB.

AB - The improvement of thermal efficiency in the light emitting diode (LED) is one of challenging topics for the wide use of high brightness LED since the excessive heat generated in the LED junction may result in the thermally induced optical and mechanical failures. To enhance thermal reliability of high brightness LED lighting, it is important to not only use components with high thermal conductivity in LED package but also improve thermal flow to the heat sink through the metal print circuit board (MPCB) where bad thermal efficiency is caused by dielectric layer with lower thermal conductivity. This study focuses on the design and fabrication of the new structure of metal PCB based on the patterned anodizing to improve thermal dissipation. The patterned anodizing makes it possible to connect the lead frame of LED package to the metal substrate directly without any thermal loss through the dielectric layer. Thus, more efficient thermal management is expected in newly designed MPCB since total thermal resistance can be reduced. In this paper, we will be present the findings, which have been resulted from thermal simulation and measurement to demonstrate the thermal performance of newly designed MPCB.

UR - http://www.scopus.com/inward/record.url?scp=79951634559&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=79951634559&partnerID=8YFLogxK

U2 - 10.1109/IMPACT.2010.5699479

DO - 10.1109/IMPACT.2010.5699479

M3 - Conference contribution

AN - SCOPUS:79951634559

SN - 9781424497836

T3 - International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings

BT - International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings

ER -

Lee MH, Lee TJ, Lee HJ, Kim YJ. Design and fabrication of metal PCB based on the patterned anodizing for improving thermal dissipation of LED lighting. In International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings. 2010. 5699479. (International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings). https://doi.org/10.1109/IMPACT.2010.5699479