Design and fabrication of metal PCB based on the patterned anodizing for improving thermal dissipation of LED lighting

Moon Ho Lee, Tae Jin Lee, Hye Jin Lee, Young Joo Kim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Abstract

The improvement of thermal efficiency in the light emitting diode (LED) is one of challenging topics for the wide use of high brightness LED since the excessive heat generated in the LED junction may result in the thermally induced optical and mechanical failures. To enhance thermal reliability of high brightness LED lighting, it is important to not only use components with high thermal conductivity in LED package but also improve thermal flow to the heat sink through the metal print circuit board (MPCB) where bad thermal efficiency is caused by dielectric layer with lower thermal conductivity. This study focuses on the design and fabrication of the new structure of metal PCB based on the patterned anodizing to improve thermal dissipation. The patterned anodizing makes it possible to connect the lead frame of LED package to the metal substrate directly without any thermal loss through the dielectric layer. Thus, more efficient thermal management is expected in newly designed MPCB since total thermal resistance can be reduced. In this paper, we will be present the findings, which have been resulted from thermal simulation and measurement to demonstrate the thermal performance of newly designed MPCB.

Original languageEnglish
Title of host publicationInternational Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings
DOIs
Publication statusPublished - 2010
Event2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference - Taipei, Taiwan, Province of China
Duration: 2010 Oct 202010 Oct 22

Publication series

NameInternational Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings

Other

Other2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference
CountryTaiwan, Province of China
CityTaipei
Period10/10/2010/10/22

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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    Lee, M. H., Lee, T. J., Lee, H. J., & Kim, Y. J. (2010). Design and fabrication of metal PCB based on the patterned anodizing for improving thermal dissipation of LED lighting. In International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings [5699479] (International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings). https://doi.org/10.1109/IMPACT.2010.5699479