Design of tracked vehicle with passive mechanism for uneven terrain

Hae Won Park, Sung Hyun Kim, No Cheol Park, Hyun Seok Yang, Young Pil Park, Seung Ho Kim, Yong Heon Park, Young Hwan Kang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

This paper describes design of tracked vehicle which can adapt rough terrain using passive link mechanism. The vehicle has two track modules at both sides which have four-bar link mechanism with passive spring elements. The passive spring elements of the link mechanism provide the restoring force which helps the vehicle to be changed to stable configuration when overcoming uneven terrains. The two track modules are connected with rotary joint so that it provides adaptability to laterally located terrain roughness. Simulating under various conditions, we verify our design concept and determine critical design parameter. We manufactured prototype vehicle with determined design parameters from simulation results. The vehicle has size of 295mm×210mm×105mm, and weight of the vehicle is 1.31kg. The prototype equips two 2.17W DC motors as driving motors. We conducted experiments with manufactured prototype under various terrain conditions. The terrain conditions include steps, stairs, trench, and unstructured terrain. In experiments, this vehicle shows good overcoming ability for the tested terrain conditions.

Original languageEnglish
Title of host publication2006 SICE-ICASE International Joint Conference
Pages3132-3136
Number of pages5
DOIs
Publication statusPublished - 2006
Event2006 SICE-ICASE International Joint Conference - Busan, Korea, Republic of
Duration: 2006 Oct 182006 Oct 21

Publication series

Name2006 SICE-ICASE International Joint Conference

Other

Other2006 SICE-ICASE International Joint Conference
Country/TerritoryKorea, Republic of
CityBusan
Period06/10/1806/10/21

All Science Journal Classification (ASJC) codes

  • Computer Science Applications
  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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