Detection of mold events using thermocouple measurements

Il Sohn, T. J. Piccone, T. T. Natarajan

Research output: Contribution to journalArticle

7 Citations (Scopus)

Abstract

Although the main objective of the sticker detection system is to detect and prevent unexpected terminations from stickers and scum entrapment in the mold, the detailed temperature measurements provide an enormous amount of data that can be utilized in detecting various events in the mold. Methods have been developed for longitudinal face crack detection and submerged entry nozzle deterioration monitoring. In addition, the temperature measurements can be applied in a thermal map from which operators and researchers can determine the locations of mold events and implement new methods of measuring the performance of advanced mold fluxes. By utilizing temperature measurements in the mold, it should also be possible to assess the castability of new and exotic grades of steel. This extension of the work is currently under development.

Original languageEnglish
Pages (from-to)44-50
Number of pages7
JournalIron and Steel Technology
Volume5
Issue number1
Publication statusPublished - 2008 Jan 1

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All Science Journal Classification (ASJC) codes

  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys
  • Materials Chemistry

Cite this

Sohn, I., Piccone, T. J., & Natarajan, T. T. (2008). Detection of mold events using thermocouple measurements. Iron and Steel Technology, 5(1), 44-50.