Development of an ultraviolet imprinting process for integrating a microlens array onto an image sensor

Seok Min Kim, Hongmin Kim, Shinill Kang

Research output: Contribution to journalArticle

19 Citations (Scopus)

Abstract

We analyzed the feasibility of using a UV imprinting process to integrate a microlens array onto an image sensor. A simulated wafer-scale image sensor chip array was fabricated for the implementation. A microlens array with a side length of 4.63μm, a sag height of 1.416μm, and a residual-layer thickness of 1.15μm was integrated onto the simulated image sensor. The standard deviations of the sag height and the residuallayer thickness were less than 0.038μm and less than 0.164μm, respectively, in whole-wafer-scale samples. The measured beam spot size (FWHM) at the imaging plane was 1.19μm, with a uniform intensity distribution and pitch in the array.

Original languageEnglish
Pages (from-to)2710-2712
Number of pages3
JournalOptics Letters
Volume31
Issue number18
DOIs
Publication statusPublished - 2006 Sep 15

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sensors
wafers
standard deviation
chips

All Science Journal Classification (ASJC) codes

  • Atomic and Molecular Physics, and Optics

Cite this

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Development of an ultraviolet imprinting process for integrating a microlens array onto an image sensor. / Kim, Seok Min; Kim, Hongmin; Kang, Shinill.

In: Optics Letters, Vol. 31, No. 18, 15.09.2006, p. 2710-2712.

Research output: Contribution to journalArticle

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