TY - GEN
T1 - Development of carbon nanotubes contact-based linear displacement sensor with large sensing range
AU - Lee, Jae Ik
AU - Choi, Jungwook
AU - Lee, Kyounghoon
AU - Jeong, Bongwon
AU - Kim, Jongbaeg
PY - 2010
Y1 - 2010
N2 - A novel displacement sensor based on contact area change of two sets of vertically aligned carbon nanotubes (VACNTs) is developed. The VACNTs synthesized on movable side of two facing microstructures are in contact with another set of VACNTs on fixed side. When the movable microstructure is displaced, the VACNTs on movable side slide on those of fixed side. The measured output current signal is linear to the displacement input to the sensor. Experimentally verified sensing range is over 2 mm, and it could be easily extended or reduced by varying the overlapped length of CNTs. By monitoring two signals from two sets of facing VACNTs, it is possible to simultaneously measure both the displacement and the direction of motion. It also enables the significant reduction of possible measurement errors from the temperature fluctuation.
AB - A novel displacement sensor based on contact area change of two sets of vertically aligned carbon nanotubes (VACNTs) is developed. The VACNTs synthesized on movable side of two facing microstructures are in contact with another set of VACNTs on fixed side. When the movable microstructure is displaced, the VACNTs on movable side slide on those of fixed side. The measured output current signal is linear to the displacement input to the sensor. Experimentally verified sensing range is over 2 mm, and it could be easily extended or reduced by varying the overlapped length of CNTs. By monitoring two signals from two sets of facing VACNTs, it is possible to simultaneously measure both the displacement and the direction of motion. It also enables the significant reduction of possible measurement errors from the temperature fluctuation.
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U2 - 10.1109/MEMSYS.2010.5442330
DO - 10.1109/MEMSYS.2010.5442330
M3 - Conference contribution
AN - SCOPUS:77952746551
SN - 9781424457649
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 627
EP - 630
BT - MEMS 2010 - The 23rd IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest
T2 - 23rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2010
Y2 - 24 January 2010 through 28 January 2010
ER -