Development of hard plastic clad fiber (HPCF)-compatible devices and demonstration of HPCF-PON

J. K. Kim, D. U. Kim, T. Y. Kim, C. S. Park, B. H. Lee, Koh Oh

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)

Abstract

We report implementation and packaging of a whole line-up of hard plastic clad fiber (HPCF)-compatible devices: HPCF pigtailed 850-nm vertical-cavity surface-emitting lasers, HPCF pigtailed GaAs PIN photodiode, and 4 × 4 HPCF power splitter. Using these devices, an all-HPCF 4 × 4 passive optical network (PON) link suitable for short reach optical networks was successfully constructed. The PON link was operating well at a data rate of 1.25 Gb/s. The structures of the devices and their fabrication processes are discussed in detail along with characterizations of transmission performance by measuring the eye diagrams.

Original languageEnglish
Pages (from-to)834-836
Number of pages3
JournalIEEE Photonics Technology Letters
Volume19
Issue number11
DOIs
Publication statusPublished - 2007 Jun 1

Bibliographical note

Funding Information:
Manuscript received October 30, 2006; revised February 25, 2007. This work was supported in part by KOSEF (Program R01-2006-000-11277-0 and Program R15-2004-024-00000-0) and the Scientific and Technological Cooperation Program between Italy and South Korea from MOST, Korea. J. K. Kim, D. U. Kim, T.-Y. Kim, C.-S. Park, and B. H. Lee are with the Department of Information and Communications, Gwangju Institute of Science and Technology (GIST), Gwangju 500-712, Korea. K. Oh is with the Institute of Physics and Applied Physics, Yonsei University, Seoul 120-749, Korea (e-mail: koh@yonsei.ac.kr). Color versions of one or more of the figures in this letter are available online at http://ieeexplore.ieee.org. Digital Object Identifier 10.1109/LPT.2007.897288

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Electrical and Electronic Engineering

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