Development of hard plastic clad fiber (HPCF)-compatible devices and demonstration of HPCF-PON

J. K. Kim, D. U. Kim, T. Y. Kim, C. S. Park, B. H. Lee, Kyunghwan Oh

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

We report implementation and packaging of a whole line-up of hard plastic clad fiber (HPCF)-compatible devices: HPCF pigtailed 850-nm vertical-cavity surface-emitting lasers, HPCF pigtailed GaAs PIN photodiode, and 4 × 4 HPCF power splitter. Using these devices, an all-HPCF 4 × 4 passive optical network (PON) link suitable for short reach optical networks was successfully constructed. The PON link was operating well at a data rate of 1.25 Gb/s. The structures of the devices and their fabrication processes are discussed in detail along with characterizations of transmission performance by measuring the eye diagrams.

Original languageEnglish
Pages (from-to)834-836
Number of pages3
JournalIEEE Photonics Technology Letters
Volume19
Issue number11
DOIs
Publication statusPublished - 2007 Jun 1

Fingerprint

plastic fibers
Passive optical networks
Demonstrations
Plastics
Fibers
Surface emitting lasers
Fiber optic networks
Photodiodes
surface emitting lasers
packaging
photodiodes
Packaging
diagrams
Fabrication
cavities
fabrication

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Electrical and Electronic Engineering

Cite this

Kim, J. K. ; Kim, D. U. ; Kim, T. Y. ; Park, C. S. ; Lee, B. H. ; Oh, Kyunghwan. / Development of hard plastic clad fiber (HPCF)-compatible devices and demonstration of HPCF-PON. In: IEEE Photonics Technology Letters. 2007 ; Vol. 19, No. 11. pp. 834-836.
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Development of hard plastic clad fiber (HPCF)-compatible devices and demonstration of HPCF-PON. / Kim, J. K.; Kim, D. U.; Kim, T. Y.; Park, C. S.; Lee, B. H.; Oh, Kyunghwan.

In: IEEE Photonics Technology Letters, Vol. 19, No. 11, 01.06.2007, p. 834-836.

Research output: Contribution to journalArticle

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