Development of polyimide films reinforced with boron nitride and boron nitride nanosheets for transparent flexible device applications

You Jin Min, Kyeong Hee Kang, Dae Eun Kim

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

The benefits of reinforcing polyimide (PI) films with boron nitride (BN) particles and boron nitride nanosheets (BNNSs) were assessed with the aim of enhancing their thermal, optical, and mechanical properties for flexible device applications. BNNSs were prepared from BN particles using a liquid-phase exfoliation method assisted by an ultrasonic probe-type sonicator and centrifugator. PI-based composite films blended with BNNSs and BN particles were fabricated at various concentrations via mechanical stirring and spin coating. The transparency of the PI/BNNS composite films remained almost the same as that of pure PI films up to 3 wt.% whereas the transparency of the PI/BN composite films decreased with increasing concentration of the BN fillers at 550 nm. The thermal stability improved significantly with increasing concentrations of both BN and BNNS relative to that of pure PI films. The temperature for 5% weight loss of the PI/BNNS composite film was higher than that of the PI/BN composite film at the same filler concentration. The composite films with 2 wt.% BN or BNNS showed the lowest wear rate, and the PI/BNNS composite films showed more stable frictional behavior compared to the PI/BN composite films. In addition, bending tests showed that the PI/BNNS composite films exhibited excellent flexibility compared to the PI/BN composite films. Overall, the results indicate that the BNNS can be effectively used as a filler that can enhance the thermal and mechanical properties of polymer materials for flexible device applications. [Figure not available: see fulltext.].

Original languageEnglish
Pages (from-to)2366-2378
Number of pages13
JournalNano Research
Volume11
Issue number5
DOIs
Publication statusPublished - 2018 May 1

Fingerprint

Boron nitride
Nanosheets
Polyimides
Composite films
boron nitride
Fillers
Transparency
Thermodynamic properties
Mechanical properties

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Electrical and Electronic Engineering

Cite this

@article{cc0a70b4febd4a61830957ba4b906c1e,
title = "Development of polyimide films reinforced with boron nitride and boron nitride nanosheets for transparent flexible device applications",
abstract = "The benefits of reinforcing polyimide (PI) films with boron nitride (BN) particles and boron nitride nanosheets (BNNSs) were assessed with the aim of enhancing their thermal, optical, and mechanical properties for flexible device applications. BNNSs were prepared from BN particles using a liquid-phase exfoliation method assisted by an ultrasonic probe-type sonicator and centrifugator. PI-based composite films blended with BNNSs and BN particles were fabricated at various concentrations via mechanical stirring and spin coating. The transparency of the PI/BNNS composite films remained almost the same as that of pure PI films up to 3 wt.{\%} whereas the transparency of the PI/BN composite films decreased with increasing concentration of the BN fillers at 550 nm. The thermal stability improved significantly with increasing concentrations of both BN and BNNS relative to that of pure PI films. The temperature for 5{\%} weight loss of the PI/BNNS composite film was higher than that of the PI/BN composite film at the same filler concentration. The composite films with 2 wt.{\%} BN or BNNS showed the lowest wear rate, and the PI/BNNS composite films showed more stable frictional behavior compared to the PI/BN composite films. In addition, bending tests showed that the PI/BNNS composite films exhibited excellent flexibility compared to the PI/BN composite films. Overall, the results indicate that the BNNS can be effectively used as a filler that can enhance the thermal and mechanical properties of polymer materials for flexible device applications. [Figure not available: see fulltext.].",
author = "Min, {You Jin} and Kang, {Kyeong Hee} and Kim, {Dae Eun}",
year = "2018",
month = "5",
day = "1",
doi = "10.1007/s12274-017-1856-0",
language = "English",
volume = "11",
pages = "2366--2378",
journal = "Nano Research",
issn = "1998-0124",
publisher = "Press of Tsinghua University",
number = "5",

}

Development of polyimide films reinforced with boron nitride and boron nitride nanosheets for transparent flexible device applications. / Min, You Jin; Kang, Kyeong Hee; Kim, Dae Eun.

In: Nano Research, Vol. 11, No. 5, 01.05.2018, p. 2366-2378.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Development of polyimide films reinforced with boron nitride and boron nitride nanosheets for transparent flexible device applications

AU - Min, You Jin

AU - Kang, Kyeong Hee

AU - Kim, Dae Eun

PY - 2018/5/1

Y1 - 2018/5/1

N2 - The benefits of reinforcing polyimide (PI) films with boron nitride (BN) particles and boron nitride nanosheets (BNNSs) were assessed with the aim of enhancing their thermal, optical, and mechanical properties for flexible device applications. BNNSs were prepared from BN particles using a liquid-phase exfoliation method assisted by an ultrasonic probe-type sonicator and centrifugator. PI-based composite films blended with BNNSs and BN particles were fabricated at various concentrations via mechanical stirring and spin coating. The transparency of the PI/BNNS composite films remained almost the same as that of pure PI films up to 3 wt.% whereas the transparency of the PI/BN composite films decreased with increasing concentration of the BN fillers at 550 nm. The thermal stability improved significantly with increasing concentrations of both BN and BNNS relative to that of pure PI films. The temperature for 5% weight loss of the PI/BNNS composite film was higher than that of the PI/BN composite film at the same filler concentration. The composite films with 2 wt.% BN or BNNS showed the lowest wear rate, and the PI/BNNS composite films showed more stable frictional behavior compared to the PI/BN composite films. In addition, bending tests showed that the PI/BNNS composite films exhibited excellent flexibility compared to the PI/BN composite films. Overall, the results indicate that the BNNS can be effectively used as a filler that can enhance the thermal and mechanical properties of polymer materials for flexible device applications. [Figure not available: see fulltext.].

AB - The benefits of reinforcing polyimide (PI) films with boron nitride (BN) particles and boron nitride nanosheets (BNNSs) were assessed with the aim of enhancing their thermal, optical, and mechanical properties for flexible device applications. BNNSs were prepared from BN particles using a liquid-phase exfoliation method assisted by an ultrasonic probe-type sonicator and centrifugator. PI-based composite films blended with BNNSs and BN particles were fabricated at various concentrations via mechanical stirring and spin coating. The transparency of the PI/BNNS composite films remained almost the same as that of pure PI films up to 3 wt.% whereas the transparency of the PI/BN composite films decreased with increasing concentration of the BN fillers at 550 nm. The thermal stability improved significantly with increasing concentrations of both BN and BNNS relative to that of pure PI films. The temperature for 5% weight loss of the PI/BNNS composite film was higher than that of the PI/BN composite film at the same filler concentration. The composite films with 2 wt.% BN or BNNS showed the lowest wear rate, and the PI/BNNS composite films showed more stable frictional behavior compared to the PI/BN composite films. In addition, bending tests showed that the PI/BNNS composite films exhibited excellent flexibility compared to the PI/BN composite films. Overall, the results indicate that the BNNS can be effectively used as a filler that can enhance the thermal and mechanical properties of polymer materials for flexible device applications. [Figure not available: see fulltext.].

UR - http://www.scopus.com/inward/record.url?scp=85031422881&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85031422881&partnerID=8YFLogxK

U2 - 10.1007/s12274-017-1856-0

DO - 10.1007/s12274-017-1856-0

M3 - Article

AN - SCOPUS:85031422881

VL - 11

SP - 2366

EP - 2378

JO - Nano Research

JF - Nano Research

SN - 1998-0124

IS - 5

ER -