Direct writing of copper conductive patterns by ink-jet printing

Bong Kyun Park, Dongjo Kim, Sunho Jeong, Jooho Moon, Jang Sub Kim

Research output: Contribution to journalArticle

404 Citations (Scopus)

Abstract

Ink-jet printing of metal nanoparticles is an attractive method for direct patterning conductive metal lines owing to low-cost, low-waste, and simple process. While most of the researches here focused on novel metals such as gold and silver, we have developed a conductive ink containing copper nanoparticles as an alternative that is inexpensive conductive material. Copper particles with a size of 40-50 nm were synthesized by polyol process, from which the well-dispersed conductive ink with low viscosity was prepared. We have successfully demonstrated a direct writing of the conductive lines using Cu conductive ink. The ink-jet printed copper patterns exhibited metal-like appearance and became highly conductive upon heat treatments. The resistivity of the film reached to 17.2 μΩ cm at 325 °C for 1 h in vacuum.

Original languageEnglish
Pages (from-to)7706-7711
Number of pages6
JournalThin Solid Films
Volume515
Issue number19 SPEC. ISS.
DOIs
Publication statusPublished - 2007 Jul 16

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Materials Chemistry

Fingerprint Dive into the research topics of 'Direct writing of copper conductive patterns by ink-jet printing'. Together they form a unique fingerprint.

  • Cite this

    Park, B. K., Kim, D., Jeong, S., Moon, J., & Kim, J. S. (2007). Direct writing of copper conductive patterns by ink-jet printing. Thin Solid Films, 515(19 SPEC. ISS.), 7706-7711. https://doi.org/10.1016/j.tsf.2006.11.142