Direct writing of copper conductive patterns by ink-jet printing

Bong Kyun Park; Dongjo Kim; Sunho Jeong; Jooho Moon; Jang Sub Kim

doi:10.1016/j.tsf.2006.11.142

Direct writing of copper conductive patterns by ink-jet printing

Bong Kyun Park, Dongjo Kim, Sunho Jeong, Jooho Moon, Jang Sub Kim

Department of Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

482 Citations (Scopus)

Abstract

Ink-jet printing of metal nanoparticles is an attractive method for direct patterning conductive metal lines owing to low-cost, low-waste, and simple process. While most of the researches here focused on novel metals such as gold and silver, we have developed a conductive ink containing copper nanoparticles as an alternative that is inexpensive conductive material. Copper particles with a size of 40-50 nm were synthesized by polyol process, from which the well-dispersed conductive ink with low viscosity was prepared. We have successfully demonstrated a direct writing of the conductive lines using Cu conductive ink. The ink-jet printed copper patterns exhibited metal-like appearance and became highly conductive upon heat treatments. The resistivity of the film reached to 17.2 μΩ cm at 325 °C for 1 h in vacuum.

Original language	English
Pages (from-to)	7706-7711
Number of pages	6
Journal	Thin Solid Films
Volume	515
Issue number	19 SPEC. ISS.
DOIs	https://doi.org/10.1016/j.tsf.2006.11.142
Publication status	Published - 2007 Jul 16

Bibliographical note

Funding Information:
This work was supported by the National Research Laboratory (NRL) Program of the Korea Science and Engineering Foundation.

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Surfaces and Interfaces
Surfaces, Coatings and Films
Metals and Alloys
Materials Chemistry

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10.1016/j.tsf.2006.11.142

Cite this

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title = "Direct writing of copper conductive patterns by ink-jet printing",

abstract = "Ink-jet printing of metal nanoparticles is an attractive method for direct patterning conductive metal lines owing to low-cost, low-waste, and simple process. While most of the researches here focused on novel metals such as gold and silver, we have developed a conductive ink containing copper nanoparticles as an alternative that is inexpensive conductive material. Copper particles with a size of 40-50 nm were synthesized by polyol process, from which the well-dispersed conductive ink with low viscosity was prepared. We have successfully demonstrated a direct writing of the conductive lines using Cu conductive ink. The ink-jet printed copper patterns exhibited metal-like appearance and became highly conductive upon heat treatments. The resistivity of the film reached to 17.2 μΩ cm at 325 °C for 1 h in vacuum.",

author = "Park, {Bong Kyun} and Dongjo Kim and Sunho Jeong and Jooho Moon and Kim, {Jang Sub}",

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AU - Kim, Dongjo

AU - Jeong, Sunho

AU - Moon, Jooho

AU - Kim, Jang Sub

N1 - Funding Information: This work was supported by the National Research Laboratory (NRL) Program of the Korea Science and Engineering Foundation.

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Y1 - 2007/7/16

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AB - Ink-jet printing of metal nanoparticles is an attractive method for direct patterning conductive metal lines owing to low-cost, low-waste, and simple process. While most of the researches here focused on novel metals such as gold and silver, we have developed a conductive ink containing copper nanoparticles as an alternative that is inexpensive conductive material. Copper particles with a size of 40-50 nm were synthesized by polyol process, from which the well-dispersed conductive ink with low viscosity was prepared. We have successfully demonstrated a direct writing of the conductive lines using Cu conductive ink. The ink-jet printed copper patterns exhibited metal-like appearance and became highly conductive upon heat treatments. The resistivity of the film reached to 17.2 μΩ cm at 325 °C for 1 h in vacuum.

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Direct writing of copper conductive patterns by ink-jet printing

Abstract

Bibliographical note

All Science Journal Classification (ASJC) codes

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