Direct writing of copper conductive patterns by ink-jet printing

Bong Kyun Park, Dongjo Kim, Sunho Jeong, Joo Ho Moon, Jang Sub Kim

Research output: Contribution to journalArticle

376 Citations (Scopus)

Abstract

Ink-jet printing of metal nanoparticles is an attractive method for direct patterning conductive metal lines owing to low-cost, low-waste, and simple process. While most of the researches here focused on novel metals such as gold and silver, we have developed a conductive ink containing copper nanoparticles as an alternative that is inexpensive conductive material. Copper particles with a size of 40-50 nm were synthesized by polyol process, from which the well-dispersed conductive ink with low viscosity was prepared. We have successfully demonstrated a direct writing of the conductive lines using Cu conductive ink. The ink-jet printed copper patterns exhibited metal-like appearance and became highly conductive upon heat treatments. The resistivity of the film reached to 17.2 μΩ cm at 325 °C for 1 h in vacuum.

Original languageEnglish
Pages (from-to)7706-7711
Number of pages6
JournalThin Solid Films
Volume515
Issue number19 SPEC. ISS.
DOIs
Publication statusPublished - 2007 Jul 16

Fingerprint

Ink jet printing
inks
Ink
printing
Copper
copper
Metals
metals
Conductive materials
Metal nanoparticles
Polyols
nanoparticles
Silver
Gold
Heat treatment
Vacuum
Viscosity
Nanoparticles
heat treatment
silver

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Materials Chemistry

Cite this

Park, Bong Kyun ; Kim, Dongjo ; Jeong, Sunho ; Moon, Joo Ho ; Kim, Jang Sub. / Direct writing of copper conductive patterns by ink-jet printing. In: Thin Solid Films. 2007 ; Vol. 515, No. 19 SPEC. ISS. pp. 7706-7711.
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Park, BK, Kim, D, Jeong, S, Moon, JH & Kim, JS 2007, 'Direct writing of copper conductive patterns by ink-jet printing', Thin Solid Films, vol. 515, no. 19 SPEC. ISS., pp. 7706-7711. https://doi.org/10.1016/j.tsf.2006.11.142

Direct writing of copper conductive patterns by ink-jet printing. / Park, Bong Kyun; Kim, Dongjo; Jeong, Sunho; Moon, Joo Ho; Kim, Jang Sub.

In: Thin Solid Films, Vol. 515, No. 19 SPEC. ISS., 16.07.2007, p. 7706-7711.

Research output: Contribution to journalArticle

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