Directional Bending Sensor Based on a Dual Side-Hole Fiber Mach-Zehnder Interferometer

Ye Tian, Quan Chai, Tao Tan, Boxin Mu, Qiang Liu, Yanlei Liu, Jing Ren, Jianzhong Zhang, Kyunghwan Oh, Elfed Lewis, Jun Yang, Zhihai Liu, Wenping Zhang, Libo Yuan

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15 Citations (Scopus)


A new directional bending sensor based on a dual side-hole fiber (DSHF) that can detect both the direction and magnitude of bending in a self-temperature compensated manner is described and experimentally demonstrated. The sensor is based on an in-fiber Mach-Zehnder interferometer (MZI), where a DSHF segment was spliced between two standard single-mode fibers (SMFs) as input and output. The sensor has two orthogonal axes which are formed by both the asymmetry in the side-hole location in DSHF and an offset in the fusion splice between the SMF and DSHF. The visibility in the MZI output intensity and the spectral shifts of MZI fringes show separate responses to the bending curvature and direction, which is a key feature of the directional curvature sensor. An inscribed fiber Bragg grating in the DSHF measure allows the temperature to be measured independently. The sensor can provide salient advantages in its unique capability to precisely quantify the direction and magnitude of bending along with its reproducibility, compactness, and suitability for mass production, which makes it suitable for many practical bending sensing applications.

Original languageEnglish
Article number8234575
Pages (from-to)375-378
Number of pages4
JournalIEEE Photonics Technology Letters
Issue number4
Publication statusPublished - 2018 Feb 15

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Electrical and Electronic Engineering

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    Tian, Y., Chai, Q., Tan, T., Mu, B., Liu, Q., Liu, Y., Ren, J., Zhang, J., Oh, K., Lewis, E., Yang, J., Liu, Z., Zhang, W., & Yuan, L. (2018). Directional Bending Sensor Based on a Dual Side-Hole Fiber Mach-Zehnder Interferometer. IEEE Photonics Technology Letters, 30(4), 375-378. [8234575].