Dynamic self-repair architectures for defective through-silicon vias

Three-dimensional integration technology results in area savings, platform power savings, and an increase in performance. Through-silicon via (TSV) assembly and manufacturing processes can potentially introduce defects. This may result in increases in manufacturing and test costs and will cause a yield problem. To improve the yield, spare TSVs can be included to repair defective TSVs. This paper proposes a new built-in self-test feature to identify defective TSV channels. For defective TSVs, this paper also introduces dynamic self-repair architectures using code-based and hardware-mapping based repair.