Dynamic self-repair architectures for defective through-silicon vias

Joon Sung Yang, Tae Hee Han, Darshan Kobla, Edward L. Ju

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

Three-dimensional integration technology results in area savings, platform power savings, and an increase in performance. Through-silicon via (TSV) assembly and manufacturing processes can potentially introduce defects. This may result in increases in manufacturing and test costs and will cause a yield problem. To improve the yield, spare TSVs can be included to repair defective TSVs. This paper proposes a new built-in self-test feature to identify defective TSV channels. For defective TSVs, this paper also introduces dynamic self-repair architectures using code-based and hardware-mapping based repair.

Original languageEnglish
Pages (from-to)301-308
Number of pages8
JournalETRI Journal
Volume36
Issue number2
DOIs
Publication statusPublished - 2014 Apr

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Computer Science(all)
  • Electrical and Electronic Engineering

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