Dynamic thermal analysis of high-power LEDs at pulse conditions

Lianqiao Yang, Jianzheng Hu, Moo Whan Shin

Research output: Contribution to journalArticle

21 Citations (Scopus)

Abstract

In this letter, the thermal evaluation of high-power LED packages at pulse conditions was reported. A theoretical calculation model was proposed based on the analogy between the thermal and electrical RC circuits. The thermal performance of LED packages driven by pulse input was calculated using the RC network extracted from transient thermal measurement. The junction temperature fluctuation band decreases with the frequency at certain duty cycles. The saturated average junction temperature rise linearly increases with the duty cycle at certain frequencies. These predictions were verified by the real-time junction temperature measurement using the peak shift method at pulse conditions. The theoretical model was found to be effective and applicable to the evaluation of the thermal performance of LEDs working at pulse conditions.

Original languageEnglish
Pages (from-to)863-866
Number of pages4
JournalIEEE Electron Device Letters
Volume29
Issue number8
DOIs
Publication statusPublished - 2008 Aug 1

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Thermoanalysis
Light emitting diodes
Temperature measurement
Hot Temperature
Temperature
Networks (circuits)

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

Yang, Lianqiao ; Hu, Jianzheng ; Shin, Moo Whan. / Dynamic thermal analysis of high-power LEDs at pulse conditions. In: IEEE Electron Device Letters. 2008 ; Vol. 29, No. 8. pp. 863-866.
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Dynamic thermal analysis of high-power LEDs at pulse conditions. / Yang, Lianqiao; Hu, Jianzheng; Shin, Moo Whan.

In: IEEE Electron Device Letters, Vol. 29, No. 8, 01.08.2008, p. 863-866.

Research output: Contribution to journalArticle

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