Abstract
In this letter, the thermal evaluation of high-power LED packages at pulse conditions was reported. A theoretical calculation model was proposed based on the analogy between the thermal and electrical RC circuits. The thermal performance of LED packages driven by pulse input was calculated using the RC network extracted from transient thermal measurement. The junction temperature fluctuation band decreases with the frequency at certain duty cycles. The saturated average junction temperature rise linearly increases with the duty cycle at certain frequencies. These predictions were verified by the real-time junction temperature measurement using the peak shift method at pulse conditions. The theoretical model was found to be effective and applicable to the evaluation of the thermal performance of LEDs working at pulse conditions.
| Original language | English |
|---|---|
| Pages (from-to) | 863-866 |
| Number of pages | 4 |
| Journal | IEEE Electron Device Letters |
| Volume | 29 |
| Issue number | 8 |
| DOIs | |
| Publication status | Published - 2008 Aug |
Bibliographical note
Funding Information:Manuscript received January 28, 2008. This work was supported by Korea Energy Management Corporation. The review of this letter was arranged by Editor C. Jagadish. The authors are with the Department of Material Science and Engineering, Myong Ji University, Yongin 449-728, Korea (e-mail: hoogez@mju.ac.kr; hoogenzeong@mju.ac.kr; mwshin@mju.ac.kr). Color versions of one or more of the figures in this letter are available online at http://ieeexplore.ieee.org. Digital Object Identifier 10.1109/LED.2008.2000953
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering