Abstract
When S-termination on a Ge(1 0 0) surface was desorbed at an elevated temperature and an atomic layer deposition (ALD) HfO 2 film was deposited, interfacial thickness was less than 1 nm. As a result, the equivalent oxide thickness (EOT) of the stack on the initially S-terminated surface was thinner than that deposited on the O 3 -oxidized surface, while HfO 2 film thickness was almost identical on both surfaces. Nevertheless, the HfO 2 stack on the initially S-terminated surface exhibited improved leakage current characteristics due to an increase in barrier height. Its thinner but robust interface will contribute to the scaling down of gate oxide integrity.
Original language | English |
---|---|
Pages (from-to) | 7179-7182 |
Number of pages | 4 |
Journal | Applied Surface Science |
Volume | 255 |
Issue number | 16 |
DOIs | |
Publication status | Published - 2009 May 30 |
All Science Journal Classification (ASJC) codes
- Chemistry(all)
- Condensed Matter Physics
- Physics and Astronomy(all)
- Surfaces and Interfaces
- Surfaces, Coatings and Films