Resistive random-access memory (ReRAM) devices for cross-point array structures require selector elements to suppress the sneak current though neighboring cells. Niobium oxide is a promising candidate for one selector-one ReRAM (1S1R) device because of its diverse electrical characteristics such as resistance threshold switching in NbO2 and resistance memory switching in Nb2O5. In this study, a new method to fabricate a self-formed 1S1R device is suggested, which uses the top electrode Pt sputtering process. During the Pt sputtering of the top electrode, it was observed that the Nb4+ in NbO2-x layer was oxidized into Nb5+, resulting in Nb2O5-rich films. Such self-formed Nb2O5/NbO2-x layer exhibits dissimilar resistance switching behaviors depending on the compliance current during memory operation. A switching model is proposed based on the resistance switching characteristics of the Nb2O5/NbO2-x layer on the compliance current during memory operation.
|Number of pages||7|
|Journal||Journal of Materials Science: Materials in Electronics|
|Publication status||Published - 2020 Sep 1|
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All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Atomic and Molecular Physics, and Optics
- Condensed Matter Physics
- Electrical and Electronic Engineering