Effect of tin on the microstructures and mechanical properties of a Au-Pt-Cu alloy

M. H. Kim, S. H. Lee, H. N. Lim, J. M. Doh, Hong Koo Baik

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The purpose of this study is to investigate the effect of small Sn additions on the microstructures and the mechanical properties of the Au-Pt-Cu alloys. The hardness of the Au-Pt-Cu-xSn alloys rapidly increased with increasing aging time at 600°C until it reached an almost constant value at aging time of 30min. In addition, the hardness of the Au-Pt-Cu-xSn (x = 0,0.1,0.3, 0.5, 1.0) alloys aged at 600°C for 30 min, rapidly increased with increasing Sn content and reached a maximum hardness at 0.5wt%, but it slightly decreased with more increasing in Sn content. This is ascribed to wide dispersion of large Pt3Sn precipitate, which is softer than matrix composed of Au-Pt-Cu-Sn solid solution. The grain size of the Au-Pt-Cu-xSn alloys decreased with increasing Sn content irrespective of the heat- and aging-treatments, but the grain size of the aged alloys was finer than that of solution treated alloys.

Original languageEnglish
Title of host publicationEco-Materials Processing and Design VII - Proceedings of the Conference of the 7th International Symposium on Eco-Materials Processing and Design, ISEPD-7
Pages278-281
Number of pages4
Publication statusPublished - 2006 Dec 1
Event7th International Symposium on Eco-Materials Processing and Design, ISEPD-7 - Chengdu, China
Duration: 2006 Jan 82006 Jan 11

Publication series

NameMaterials Science Forum
Volume510-511
ISSN (Print)0255-5476

Other

Other7th International Symposium on Eco-Materials Processing and Design, ISEPD-7
CountryChina
CityChengdu
Period06/1/806/1/11

Fingerprint

Tin
tin
mechanical properties
Mechanical properties
microstructure
Microstructure
hardness
Aging of materials
Hardness
grain size
Precipitates
precipitates
Solid solutions
solid solutions
heat
matrices

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Kim, M. H., Lee, S. H., Lim, H. N., Doh, J. M., & Baik, H. K. (2006). Effect of tin on the microstructures and mechanical properties of a Au-Pt-Cu alloy. In Eco-Materials Processing and Design VII - Proceedings of the Conference of the 7th International Symposium on Eco-Materials Processing and Design, ISEPD-7 (pp. 278-281). (Materials Science Forum; Vol. 510-511).
Kim, M. H. ; Lee, S. H. ; Lim, H. N. ; Doh, J. M. ; Baik, Hong Koo. / Effect of tin on the microstructures and mechanical properties of a Au-Pt-Cu alloy. Eco-Materials Processing and Design VII - Proceedings of the Conference of the 7th International Symposium on Eco-Materials Processing and Design, ISEPD-7. 2006. pp. 278-281 (Materials Science Forum).
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Kim, MH, Lee, SH, Lim, HN, Doh, JM & Baik, HK 2006, Effect of tin on the microstructures and mechanical properties of a Au-Pt-Cu alloy. in Eco-Materials Processing and Design VII - Proceedings of the Conference of the 7th International Symposium on Eco-Materials Processing and Design, ISEPD-7. Materials Science Forum, vol. 510-511, pp. 278-281, 7th International Symposium on Eco-Materials Processing and Design, ISEPD-7, Chengdu, China, 06/1/8.

Effect of tin on the microstructures and mechanical properties of a Au-Pt-Cu alloy. / Kim, M. H.; Lee, S. H.; Lim, H. N.; Doh, J. M.; Baik, Hong Koo.

Eco-Materials Processing and Design VII - Proceedings of the Conference of the 7th International Symposium on Eco-Materials Processing and Design, ISEPD-7. 2006. p. 278-281 (Materials Science Forum; Vol. 510-511).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Kim MH, Lee SH, Lim HN, Doh JM, Baik HK. Effect of tin on the microstructures and mechanical properties of a Au-Pt-Cu alloy. In Eco-Materials Processing and Design VII - Proceedings of the Conference of the 7th International Symposium on Eco-Materials Processing and Design, ISEPD-7. 2006. p. 278-281. (Materials Science Forum).