Effects of Cu addition on the microstructure and localized corrosion resistance of hyper duplex stainless steels aged at 748K

Kyeong Ho Kong, Soon Hyeok Jeon, Soon Tae Kim, Do Hyang Kim, Byoung Jin Kim, Hwan Uk Guim, Moon Byung Moon, Yong Soo Park

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

The effects of Cu addition on the microstructure and localized corrosion of hyper duplex stainless steels aged at 748K were investigated using TEM analysis and electrochemical test. The addition of Cu to the base alloy facilitated the precipitation of a Cr-enriched α′A-phase due to an increase in the Cr activity, thereby reducing the localized corrosion resistance. The localized corrosion was initiated at the Cr-depleted regions around the Cr-enriched α′-phase.

Original languageEnglish
Pages (from-to)749-754
Number of pages6
JournalMaterials Transactions
Volume56
Issue number5
DOIs
Publication statusPublished - 2015 Jan 1

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Stainless Steel
corrosion resistance
Corrosion resistance
stainless steels
corrosion
Stainless steel
Corrosion
microstructure
Microstructure
Transmission electron microscopy
transmission electron microscopy

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Kong, Kyeong Ho ; Jeon, Soon Hyeok ; Kim, Soon Tae ; Kim, Do Hyang ; Kim, Byoung Jin ; Guim, Hwan Uk ; Moon, Moon Byung ; Park, Yong Soo. / Effects of Cu addition on the microstructure and localized corrosion resistance of hyper duplex stainless steels aged at 748K. In: Materials Transactions. 2015 ; Vol. 56, No. 5. pp. 749-754.
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Effects of Cu addition on the microstructure and localized corrosion resistance of hyper duplex stainless steels aged at 748K. / Kong, Kyeong Ho; Jeon, Soon Hyeok; Kim, Soon Tae; Kim, Do Hyang; Kim, Byoung Jin; Guim, Hwan Uk; Moon, Moon Byung; Park, Yong Soo.

In: Materials Transactions, Vol. 56, No. 5, 01.01.2015, p. 749-754.

Research output: Contribution to journalArticle

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