Abstract
The effects of SF6 and NF3 gas plasma treatments, and successive rapid thermal anneal (RTA) treatment for the recovery of modified silicon surface due to CHF3/C2F6 plasma have been investigated using X-ray photoelectron spectroscopy (XPS) and secondary ion mass spectrometry (SIMS). XPS analyses have revealed that NF3 and SF6 plasma treatments are effective for the removal of residue layer. SIMS results show that penetrated impurities in the contaminated silicon substrate reduce through the additional RTA treatment. The effects of NF3, SF6 plasmas, and additional RTA treatments for the recovery of reactive ion etched silicon surface has been also studied by measuring the electrical performance of the silicon devices.
| Original language | English |
|---|---|
| Title of host publication | Diagnostic Techniques for Semiconductor Materials Processing |
| Publisher | Publ by Materials Research Society |
| Pages | 481-486 |
| Number of pages | 6 |
| Volume | 324 |
| ISBN (Print) | 1558992235 |
| Publication status | Published - 1994 Jan 1 |
| Event | Proceedings of the 1993 Fall Meeting of the Materials Research Society - Boston, MA, USA Duration: 1993 Nov 29 → 1993 Dec 2 |
Other
| Other | Proceedings of the 1993 Fall Meeting of the Materials Research Society |
|---|---|
| City | Boston, MA, USA |
| Period | 93/11/29 → 93/12/2 |
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All Science Journal Classification (ASJC) codes
- Materials Science(all)
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering
Cite this
Kwon, K. H., Kim, B. W., Park, H. H., Kang, J. Y., & Yeom, G. Y. (1994). Effects of halogen-containing gas plasma and rapid thermal anneal treatment on the reactive ion etched silicon. In Diagnostic Techniques for Semiconductor Materials Processing (Vol. 324, pp. 481-486). Publ by Materials Research Society.