Effects of H2 addition in magnetized inductively coupled C2F6 plasma etching of silica aerogel film

Seok Joo Wang; Hyung Ho Park; Sang Hoon Hyun; Geun Young Yeom

doi:10.1109/IMNC.2000.872712

Effects of H₂ addition in magnetized inductively coupled C₂F₆ plasma etching of silica aerogel film

Seok Joo Wang, Hyung Ho Park, Sang Hoon Hyun, Geun Young Yeom

Department of Materials Science and Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Low k dielectrics not only lower line-to-line capacitance, but also reduce cross-talk noise in the interconnect and alleviate power dissipation issues. Silica aerogel film is a promising candidate for low-k innerlevel dielectrics by its ca. 70% porosity.¹⁾ As one of manufacture processes, etching behavior was considered with the increasing of H₂ gas addition to C₂F₆ gas.

Original language	English
Title of host publication	Digest of Papers - 2000 International Microprocesses and Nanotechnology Conference, MNC 2000
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	206-207
Number of pages	2
ISBN (Electronic)	4891140046, 9784891140045
DOIs	https://doi.org/10.1109/IMNC.2000.872712
Publication status	Published - 2000
Event	International Microprocesses and Nanotechnology Conference, MNC 2000 - Tokyo, Japan Duration: 2000 Jul 11 → 2000 Jul 13

Publication series

Name	Digest of Papers - 2000 International Microprocesses and Nanotechnology Conference, MNC 2000

Other

Other	International Microprocesses and Nanotechnology Conference, MNC 2000
Country/Territory	Japan
City	Tokyo
Period	00/7/11 → 00/7/13

All Science Journal Classification (ASJC) codes

Biotechnology
Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials

Access to Document

10.1109/IMNC.2000.872712

Cite this

Wang, S. J., Park, H. H., Hyun, S. H., & Yeom, G. Y. (2000). Effects of H₂ addition in magnetized inductively coupled C₂F₆ plasma etching of silica aerogel film. In Digest of Papers - 2000 International Microprocesses and Nanotechnology Conference, MNC 2000 (pp. 206-207). [872712] (Digest of Papers - 2000 International Microprocesses and Nanotechnology Conference, MNC 2000). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IMNC.2000.872712

Wang, Seok Joo ; Park, Hyung Ho ; Hyun, Sang Hoon et al. / Effects of H₂ addition in magnetized inductively coupled C₂F₆ plasma etching of silica aerogel film. Digest of Papers - 2000 International Microprocesses and Nanotechnology Conference, MNC 2000. Institute of Electrical and Electronics Engineers Inc., 2000. pp. 206-207 (Digest of Papers - 2000 International Microprocesses and Nanotechnology Conference, MNC 2000).

@inproceedings{b28e7625fb6d41949f6ea37297b557ed,

title = "Effects of H2 addition in magnetized inductively coupled C2F6 plasma etching of silica aerogel film",

abstract = "Low k dielectrics not only lower line-to-line capacitance, but also reduce cross-talk noise in the interconnect and alleviate power dissipation issues. Silica aerogel film is a promising candidate for low-k innerlevel dielectrics by its ca. 70% porosity.1) As one of manufacture processes, etching behavior was considered with the increasing of H2 gas addition to C2F6 gas.",

author = "Wang, {Seok Joo} and Park, {Hyung Ho} and Hyun, {Sang Hoon} and Yeom, {Geun Young}",

year = "2000",

doi = "10.1109/IMNC.2000.872712",

language = "English",

series = "Digest of Papers - 2000 International Microprocesses and Nanotechnology Conference, MNC 2000",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "206--207",

booktitle = "Digest of Papers - 2000 International Microprocesses and Nanotechnology Conference, MNC 2000",

address = "United States",

note = "International Microprocesses and Nanotechnology Conference, MNC 2000 ; Conference date: 11-07-2000 Through 13-07-2000",

}

Wang, SJ, Park, HH, Hyun, SH & Yeom, GY 2000, Effects of H₂ addition in magnetized inductively coupled C₂F₆ plasma etching of silica aerogel film. in Digest of Papers - 2000 International Microprocesses and Nanotechnology Conference, MNC 2000., 872712, Digest of Papers - 2000 International Microprocesses and Nanotechnology Conference, MNC 2000, Institute of Electrical and Electronics Engineers Inc., pp. 206-207, International Microprocesses and Nanotechnology Conference, MNC 2000, Tokyo, Japan, 00/7/11. https://doi.org/10.1109/IMNC.2000.872712

Effects of H₂ addition in magnetized inductively coupled C₂F₆ plasma etching of silica aerogel film. / Wang, Seok Joo; Park, Hyung Ho; Hyun, Sang Hoon et al.

Digest of Papers - 2000 International Microprocesses and Nanotechnology Conference, MNC 2000. Institute of Electrical and Electronics Engineers Inc., 2000. p. 206-207 872712 (Digest of Papers - 2000 International Microprocesses and Nanotechnology Conference, MNC 2000).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Effects of H2 addition in magnetized inductively coupled C2F6 plasma etching of silica aerogel film

AU - Wang, Seok Joo

AU - Park, Hyung Ho

AU - Hyun, Sang Hoon

AU - Yeom, Geun Young

PY - 2000

Y1 - 2000

N2 - Low k dielectrics not only lower line-to-line capacitance, but also reduce cross-talk noise in the interconnect and alleviate power dissipation issues. Silica aerogel film is a promising candidate for low-k innerlevel dielectrics by its ca. 70% porosity.1) As one of manufacture processes, etching behavior was considered with the increasing of H2 gas addition to C2F6 gas.

AB - Low k dielectrics not only lower line-to-line capacitance, but also reduce cross-talk noise in the interconnect and alleviate power dissipation issues. Silica aerogel film is a promising candidate for low-k innerlevel dielectrics by its ca. 70% porosity.1) As one of manufacture processes, etching behavior was considered with the increasing of H2 gas addition to C2F6 gas.

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DO - 10.1109/IMNC.2000.872712

M3 - Conference contribution

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T3 - Digest of Papers - 2000 International Microprocesses and Nanotechnology Conference, MNC 2000

SP - 206

EP - 207

BT - Digest of Papers - 2000 International Microprocesses and Nanotechnology Conference, MNC 2000

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - International Microprocesses and Nanotechnology Conference, MNC 2000

Y2 - 11 July 2000 through 13 July 2000

ER -

Wang SJ, Park HH, Hyun SH, Yeom GY. Effects of H₂ addition in magnetized inductively coupled C₂F₆ plasma etching of silica aerogel film. In Digest of Papers - 2000 International Microprocesses and Nanotechnology Conference, MNC 2000. Institute of Electrical and Electronics Engineers Inc. 2000. p. 206-207. 872712. (Digest of Papers - 2000 International Microprocesses and Nanotechnology Conference, MNC 2000). doi: 10.1109/IMNC.2000.872712