Effects of laser drilling through silicon substrate on MOSFET device characteristics

Youngkyu Song; Chulhyun Park; Junghan Kang; Ik Bu Sohn; Young Chul Noh; Jongmin Lee; Eung Jang Lee; Seung Han Park; Soogil Lee; Jongill Hong; Ilgu Yun

doi:10.1109/INEC.2010.5424968

Effects of laser drilling through silicon substrate on MOSFET device characteristics

Youngkyu Song, Chulhyun Park, Junghan Kang, Ik Bu Sohn, Young Chul Noh, Jongmin Lee, Eung Jang Lee, Seung Han Park, Soogil Lee, Jongill Hong, Ilgu Yun

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

The effects of laser drilling through silicon substrate formed by femtosecond laser on n-type MOSFET device characteristics are investigated. The tested MOSFET device structures are fabricated using the commercial 130-nm process. Through via holes and laser scanning line affect the device characteristics, such as drain current and threshold voltage, depending on the distance between the location of the drilling . The device degradation and variation along with a distance from the holes or the line are examined and the device characteristic variation is analyzed to determine the reliability of MOSFET devices against laser drilling damage.

Original language	English
Title of host publication	INEC 2010 - 2010 3rd International Nanoelectronics Conference, Proceedings
Pages	1167-1168
Number of pages	2
DOIs	https://doi.org/10.1109/INEC.2010.5424968
Publication status	Published - 2010
Event	2010 3rd International Nanoelectronics Conference, INEC 2010 - Hongkong, China Duration: 2010 Jan 3 → 2010 Jan 8

Publication series

Name	INEC 2010 - 2010 3rd International Nanoelectronics Conference, Proceedings

Other

Other	2010 3rd International Nanoelectronics Conference, INEC 2010
Country/Territory	China
City	Hongkong
Period	10/1/3 → 10/1/8

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering

Access to Document

10.1109/INEC.2010.5424968

Cite this

Song, Y., Park, C., Kang, J., Sohn, I. B., Noh, Y. C., Lee, J., Lee, E. J., Park, S. H., Lee, S., Hong, J., & Yun, I. (2010). Effects of laser drilling through silicon substrate on MOSFET device characteristics. In INEC 2010 - 2010 3rd International Nanoelectronics Conference, Proceedings (pp. 1167-1168). [5424968] (INEC 2010 - 2010 3rd International Nanoelectronics Conference, Proceedings). https://doi.org/10.1109/INEC.2010.5424968

@inproceedings{a252a94ce3d844fe8a31ae152efd47af,

title = "Effects of laser drilling through silicon substrate on MOSFET device characteristics",

abstract = "The effects of laser drilling through silicon substrate formed by femtosecond laser on n-type MOSFET device characteristics are investigated. The tested MOSFET device structures are fabricated using the commercial 130-nm process. Through via holes and laser scanning line affect the device characteristics, such as drain current and threshold voltage, depending on the distance between the location of the drilling . The device degradation and variation along with a distance from the holes or the line are examined and the device characteristic variation is analyzed to determine the reliability of MOSFET devices against laser drilling damage.",

author = "Youngkyu Song and Chulhyun Park and Junghan Kang and Sohn, {Ik Bu} and Noh, {Young Chul} and Jongmin Lee and Lee, {Eung Jang} and Park, {Seung Han} and Soogil Lee and Jongill Hong and Ilgu Yun",

year = "2010",

doi = "10.1109/INEC.2010.5424968",

language = "English",

isbn = "9781424435449",

series = "INEC 2010 - 2010 3rd International Nanoelectronics Conference, Proceedings",

pages = "1167--1168",

booktitle = "INEC 2010 - 2010 3rd International Nanoelectronics Conference, Proceedings",

note = "2010 3rd International Nanoelectronics Conference, INEC 2010 ; Conference date: 03-01-2010 Through 08-01-2010",

}

Song, Y, Park, C, Kang, J, Sohn, IB, Noh, YC, Lee, J, Lee, EJ, Park, SH, Lee, S, Hong, J & Yun, I 2010, Effects of laser drilling through silicon substrate on MOSFET device characteristics. in INEC 2010 - 2010 3rd International Nanoelectronics Conference, Proceedings., 5424968, INEC 2010 - 2010 3rd International Nanoelectronics Conference, Proceedings, pp. 1167-1168, 2010 3rd International Nanoelectronics Conference, INEC 2010, Hongkong, China, 10/1/3. https://doi.org/10.1109/INEC.2010.5424968

Effects of laser drilling through silicon substrate on MOSFET device characteristics. / Song, Youngkyu; Park, Chulhyun; Kang, Junghan et al.

INEC 2010 - 2010 3rd International Nanoelectronics Conference, Proceedings. 2010. p. 1167-1168 5424968 (INEC 2010 - 2010 3rd International Nanoelectronics Conference, Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Effects of laser drilling through silicon substrate on MOSFET device characteristics

AU - Song, Youngkyu

AU - Park, Chulhyun

AU - Kang, Junghan

AU - Sohn, Ik Bu

AU - Noh, Young Chul

AU - Lee, Jongmin

AU - Lee, Eung Jang

AU - Park, Seung Han

AU - Lee, Soogil

AU - Hong, Jongill

AU - Yun, Ilgu

PY - 2010

Y1 - 2010

N2 - The effects of laser drilling through silicon substrate formed by femtosecond laser on n-type MOSFET device characteristics are investigated. The tested MOSFET device structures are fabricated using the commercial 130-nm process. Through via holes and laser scanning line affect the device characteristics, such as drain current and threshold voltage, depending on the distance between the location of the drilling . The device degradation and variation along with a distance from the holes or the line are examined and the device characteristic variation is analyzed to determine the reliability of MOSFET devices against laser drilling damage.

AB - The effects of laser drilling through silicon substrate formed by femtosecond laser on n-type MOSFET device characteristics are investigated. The tested MOSFET device structures are fabricated using the commercial 130-nm process. Through via holes and laser scanning line affect the device characteristics, such as drain current and threshold voltage, depending on the distance between the location of the drilling . The device degradation and variation along with a distance from the holes or the line are examined and the device characteristic variation is analyzed to determine the reliability of MOSFET devices against laser drilling damage.

UR - http://www.scopus.com/inward/record.url?scp=77951654970&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=77951654970&partnerID=8YFLogxK

U2 - 10.1109/INEC.2010.5424968

DO - 10.1109/INEC.2010.5424968

M3 - Conference contribution

AN - SCOPUS:77951654970

SN - 9781424435449

T3 - INEC 2010 - 2010 3rd International Nanoelectronics Conference, Proceedings

SP - 1167

EP - 1168

BT - INEC 2010 - 2010 3rd International Nanoelectronics Conference, Proceedings

T2 - 2010 3rd International Nanoelectronics Conference, INEC 2010

Y2 - 3 January 2010 through 8 January 2010

ER -

Effects of laser drilling through silicon substrate on MOSFET device characteristics

Abstract

Publication series

Other

All Science Journal Classification (ASJC) codes

Access to Document

Other files and links

Fingerprint

Cite this