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Effects of post etch treatments on contaminated silicon surface due to CHF3/C2F6 reactive ion etching
H. H. Park, K. H. Kwon, S. H. Lee, S. Nahm, J. W. Lee, B. H. Koak, K. S. Suh, O. J. Kwon, J. L. Lee, G. Y. Yeom
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution