Effects of proximity on hardness and elastic modulus measurements of SiO2 and Cu by nanoindentation

Hae Jin Kim; Dae Eun Kim

doi:10.1007/s11249-012-0050-5

Effects of proximity on hardness and elastic modulus measurements of SiO₂ and Cu by nanoindentation

Hae Jin Kim, Dae Eun Kim

Department of Mechanical Engineering

Research output: Contribution to journal › Article › peer-review

18 Citations (Scopus)

Abstract

The effects of distance between two indentation points in the measurements of hardness and elastic modulus by the nanoindentation technique were assessed. Silicon Oxide (SiO₂) and Cu were used to represent the nanoindentation behavior of brittle and ductile material, respectively. The distance between two indentation points was varied from being sufficiently far apart to being almost adjacent to the boundary of the neighboring indentation mark. Contrary to common understanding, it was discovered that proximity between indentation points had almost no effect on the hardness and elastic modulus measurements. Finite element method simulations were also performed to understand and verify the experimental results.

Original language	English
Pages (from-to)	85-94
Number of pages	10
Journal	Tribology Letters
Volume	49
Issue number	1
DOIs	https://doi.org/10.1007/s11249-012-0050-5
Publication status	Published - 2013 Jan

Bibliographical note

Funding Information:
Acknowledgments This work was supported by the National Research Foundation of Korea (NRF) grant funded by the Korea government (MEST) (No. 2011-0000409).

All Science Journal Classification (ASJC) codes

Mechanics of Materials
Mechanical Engineering
Surfaces and Interfaces
Surfaces, Coatings and Films

Access to Document

10.1007/s11249-012-0050-5

Cite this

@article{f52b3528b62c4e6fb6779f72629146b1,

title = "Effects of proximity on hardness and elastic modulus measurements of SiO2 and Cu by nanoindentation",

abstract = "The effects of distance between two indentation points in the measurements of hardness and elastic modulus by the nanoindentation technique were assessed. Silicon Oxide (SiO2) and Cu were used to represent the nanoindentation behavior of brittle and ductile material, respectively. The distance between two indentation points was varied from being sufficiently far apart to being almost adjacent to the boundary of the neighboring indentation mark. Contrary to common understanding, it was discovered that proximity between indentation points had almost no effect on the hardness and elastic modulus measurements. Finite element method simulations were also performed to understand and verify the experimental results.",

author = "Kim, {Hae Jin} and Kim, {Dae Eun}",

note = "Funding Information: Acknowledgments This work was supported by the National Research Foundation of Korea (NRF) grant funded by the Korea government (MEST) (No. 2011-0000409).",

year = "2013",

month = jan,

doi = "10.1007/s11249-012-0050-5",

language = "English",

volume = "49",

pages = "85--94",

journal = "Tribology Letters",

issn = "1023-8883",

publisher = "Springer New York",

number = "1",

}

TY - JOUR

T1 - Effects of proximity on hardness and elastic modulus measurements of SiO2 and Cu by nanoindentation

AU - Kim, Hae Jin

AU - Kim, Dae Eun

N1 - Funding Information: Acknowledgments This work was supported by the National Research Foundation of Korea (NRF) grant funded by the Korea government (MEST) (No. 2011-0000409).

PY - 2013/1

Y1 - 2013/1

N2 - The effects of distance between two indentation points in the measurements of hardness and elastic modulus by the nanoindentation technique were assessed. Silicon Oxide (SiO2) and Cu were used to represent the nanoindentation behavior of brittle and ductile material, respectively. The distance between two indentation points was varied from being sufficiently far apart to being almost adjacent to the boundary of the neighboring indentation mark. Contrary to common understanding, it was discovered that proximity between indentation points had almost no effect on the hardness and elastic modulus measurements. Finite element method simulations were also performed to understand and verify the experimental results.

AB - The effects of distance between two indentation points in the measurements of hardness and elastic modulus by the nanoindentation technique were assessed. Silicon Oxide (SiO2) and Cu were used to represent the nanoindentation behavior of brittle and ductile material, respectively. The distance between two indentation points was varied from being sufficiently far apart to being almost adjacent to the boundary of the neighboring indentation mark. Contrary to common understanding, it was discovered that proximity between indentation points had almost no effect on the hardness and elastic modulus measurements. Finite element method simulations were also performed to understand and verify the experimental results.

UR - http://www.scopus.com/inward/record.url?scp=84874483730&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84874483730&partnerID=8YFLogxK

U2 - 10.1007/s11249-012-0050-5

DO - 10.1007/s11249-012-0050-5

M3 - Article

AN - SCOPUS:84874483730

SN - 1023-8883

VL - 49

SP - 85

EP - 94

JO - Tribology Letters

JF - Tribology Letters

IS - 1

ER -