Effects of surface terminal bonds and microstructure of SiO2 aerogel films on dry etching

Seok Joo Wang, Hyung-Ho Park, Geun Young Yeom, Sang Hoon Hyun

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

The effects of microstructure and surface terminal bonds of SiO2 aerogel films on dry etching were investigated using Ar, SF6, and C2F6 plasma gases. With Ar plasma etching, physical effect of ion bombardment on porous film was found. In residue-free SF6 plasma etching, reactive etchant transport and high-mass ion bombardment were observed. With C2F6 plasma etching, fluorocarbon residue layer was revealed to maintain surface morphology as acting a barrier to radical transport and ion bombardment. An etching of 450 °C-annealed SiO2 aerogel showed that a dense surface induced the decrease in reaction area, inhibition of etchant transport, and then uniform etching.

Original languageEnglish
Pages (from-to)457-462
Number of pages6
JournalApplied Surface Science
Volume169-170
DOIs
Publication statusPublished - 2001 Jan 15

Fingerprint

Dry etching
Aerogels
Plasma etching
Ion bombardment
Microstructure
Etching
Plasma Gases
Fluorocarbons
Surface morphology
Plasmas
Gases

All Science Journal Classification (ASJC) codes

  • Surfaces, Coatings and Films

Cite this

Wang, Seok Joo ; Park, Hyung-Ho ; Yeom, Geun Young ; Hyun, Sang Hoon. / Effects of surface terminal bonds and microstructure of SiO2 aerogel films on dry etching. In: Applied Surface Science. 2001 ; Vol. 169-170. pp. 457-462.
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Effects of surface terminal bonds and microstructure of SiO2 aerogel films on dry etching. / Wang, Seok Joo; Park, Hyung-Ho; Yeom, Geun Young; Hyun, Sang Hoon.

In: Applied Surface Science, Vol. 169-170, 15.01.2001, p. 457-462.

Research output: Contribution to journalArticle

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