Efficient TSV repair method for 3D memories

Ilwoong Kim, Keewon Cho, Sungho Kang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Through-silicon-via (TSV) based 3D stacked memory is recognized as the next generation memory architecture but its low TSV yield is one of the manufacturing cost factors. In this paper, an efficient TSV repair method is proposed for 3D memories. The proposed method uses a new 2-dimensional 1-4 switching technique to enable efficient repair of clustered TSV faults using repair circuitry with reasonable area overhead. Therefore, the proposed TSV repair method can contribute the improvement of TSV yield for 3D memories.

Original languageEnglish
Title of host publicationISOCC 2013 - 2013 International SoC Design Conference
PublisherIEEE Computer Society
Pages17-18
Number of pages2
ISBN (Print)9781479911417
DOIs
Publication statusPublished - 2013
Event2013 International SoC Design Conference, ISOCC 2013 - Busan, Korea, Republic of
Duration: 2013 Nov 172013 Nov 19

Publication series

NameISOCC 2013 - 2013 International SoC Design Conference

Other

Other2013 International SoC Design Conference, ISOCC 2013
Country/TerritoryKorea, Republic of
CityBusan
Period13/11/1713/11/19

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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