Electric field analysis for micro-EDM deburring process

Byung Han Yoo, Young Hun Jeong, Byung-Kwon Min, Sang Jo Lee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

Micro electrical discharge machining process is widely used for making small holes and machining micro molds. Recently, micro-EDM process was applied to the deburring process in the microdevices. Burrs at the edge of the devices were removed effectively with minimizing damage of machined surface. The electric field strength between the electrode and the workpiece was analyzed according to the geometry of burrs. The analyzed electric strength was compared to the dielectric strength of kerosene. The electrical discharge mechanism at the burr instead of the surface of the wokrpiece plane was explained by the electric field strength distribution. The characteristics of micro-EDM deburring process in the microdevices were studied. Adujusting the electrode tool position precisely, the burrs on the surface remained could be removed successfully. In this research, through the electric strength analysis, the applying the micro-EDM process to the deburring process was suggested.

Original languageEnglish
Title of host publicationICSMA 2008 - International Conference on Smart Manufacturing Application
Pages239-242
Number of pages4
DOIs
Publication statusPublished - 2008 Sep 1
EventInternational Conference on Smart Manufacturing Application, ICSMA 2008 - Gyeonggi-do, Korea, Republic of
Duration: 2008 Apr 92008 Apr 11

Other

OtherInternational Conference on Smart Manufacturing Application, ICSMA 2008
CountryKorea, Republic of
CityGyeonggi-do
Period08/4/908/4/11

Fingerprint

Deburring
Electric fields
Electrodes
Electric discharge machining
Kerosene
Molds
Machining
Geometry

All Science Journal Classification (ASJC) codes

  • Artificial Intelligence
  • Control and Systems Engineering
  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering

Cite this

Yoo, B. H., Jeong, Y. H., Min, B-K., & Lee, S. J. (2008). Electric field analysis for micro-EDM deburring process. In ICSMA 2008 - International Conference on Smart Manufacturing Application (pp. 239-242). [4505649] https://doi.org/10.1109/ICSMA.2008.4505649
Yoo, Byung Han ; Jeong, Young Hun ; Min, Byung-Kwon ; Lee, Sang Jo. / Electric field analysis for micro-EDM deburring process. ICSMA 2008 - International Conference on Smart Manufacturing Application. 2008. pp. 239-242
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Yoo, BH, Jeong, YH, Min, B-K & Lee, SJ 2008, Electric field analysis for micro-EDM deburring process. in ICSMA 2008 - International Conference on Smart Manufacturing Application., 4505649, pp. 239-242, International Conference on Smart Manufacturing Application, ICSMA 2008, Gyeonggi-do, Korea, Republic of, 08/4/9. https://doi.org/10.1109/ICSMA.2008.4505649

Electric field analysis for micro-EDM deburring process. / Yoo, Byung Han; Jeong, Young Hun; Min, Byung-Kwon; Lee, Sang Jo.

ICSMA 2008 - International Conference on Smart Manufacturing Application. 2008. p. 239-242 4505649.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Yoo BH, Jeong YH, Min B-K, Lee SJ. Electric field analysis for micro-EDM deburring process. In ICSMA 2008 - International Conference on Smart Manufacturing Application. 2008. p. 239-242. 4505649 https://doi.org/10.1109/ICSMA.2008.4505649