Ordered mesoporous silica films using Brij-76 surfactant were prepared from self-assembly of organic-inorganic species and their electrical/mechanical properties were investigated for low-k application. X-ray diffraction pattern revealed highly textured pore structure. Adequate dielectric properties could be realized by controlling the chemical species of silica wall. Porosity of mesoporous silica film was 39 ± 2% and elastic modulus and hardness of the film were 14.4 and 1.25 GPa, respectively. The dielectric constant and leakage current density were measured as 2.55 and less than 2 × 10 -6 A/cm 2 up to 1.6 MV/cm, respectively.
|Number of pages||4|
|Journal||Applied Surface Science|
|Publication status||Published - 2005 May 15|
|Event||12th International Conference on Solid Films and Surfaces - Hammatsu, Japan|
Duration: 2004 Jun 21 → 2004 Jun 25
Bibliographical noteFunding Information:
The authors wish to acknowledge the financial support from KISTEP (M1-0214-00-0228). Experiments at PLS were supported in part by the MOST and POSTECH.
All Science Journal Classification (ASJC) codes
- Condensed Matter Physics
- Physics and Astronomy(all)
- Surfaces and Interfaces
- Surfaces, Coatings and Films