Electrodeposition and characterization of nanocrystalline Ni-B with low boron content for MEMS applications

Hong Beom Kwon, Kyong Tae Kim, Hye Rin Ahn, Yong-Jun Kim

Research output: Contribution to journalArticle

9 Citations (Scopus)

Abstract

We fabricated and characterized three kinds of nanocrystalline (NC) Ni-B electrodeposits with low boron content (i.e., 0.05, 0.12, and 0.19 wt.%) for micro-electromechanical system (MEMS) applications. The fabrication was performed by electrodeposition in a nickel sulfamate solution, adjusting the concentration of the boron source, dimethyleamine borane (DMAB). The electrodeposits exhibited high thermal stability, being able to maintain their grain size at 573 K, whereas pure NC Ni started recrystallizing at 473 K. This can be explained by the formation of NixB precipitators in the nickel matrix, which then migrate to the grain boundary region and effectively impede grain growth at high temperatures. Furthermore, the mechanical properties of NC Ni-B electrodeposits were significantly enhanced and they exhibited excellent mechanical performance. The hardness and elastic modulus of Ni-0.19B with 573 K heat treatment are 251.4 and 12.6 GPa, respectively, which are much higher than those of pure NC Ni. These outstanding properties show the potential applicability of NC Ni-B electrodeposits as microgears, micocantilevers, microactuators, and MEMS probe cards, which require high mechanical performance and thermal stability.

Original languageEnglish
Pages (from-to)225-234
Number of pages10
JournalSensors and Materials
Volume29
Issue number3
DOIs
Publication statusPublished - 2017 Jan 1

Fingerprint

Boron
Nickel
Electrodeposition
electrodeposition
microelectromechanical systems
MEMS
boron
Thermodynamic stability
thermal stability
precipitators
nickel
Boranes
Microactuators
boranes
cards
Grain growth
modulus of elasticity
Grain boundaries
heat treatment
hardness

All Science Journal Classification (ASJC) codes

  • Instrumentation
  • Materials Science(all)

Cite this

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abstract = "We fabricated and characterized three kinds of nanocrystalline (NC) Ni-B electrodeposits with low boron content (i.e., 0.05, 0.12, and 0.19 wt.{\%}) for micro-electromechanical system (MEMS) applications. The fabrication was performed by electrodeposition in a nickel sulfamate solution, adjusting the concentration of the boron source, dimethyleamine borane (DMAB). The electrodeposits exhibited high thermal stability, being able to maintain their grain size at 573 K, whereas pure NC Ni started recrystallizing at 473 K. This can be explained by the formation of NixB precipitators in the nickel matrix, which then migrate to the grain boundary region and effectively impede grain growth at high temperatures. Furthermore, the mechanical properties of NC Ni-B electrodeposits were significantly enhanced and they exhibited excellent mechanical performance. The hardness and elastic modulus of Ni-0.19B with 573 K heat treatment are 251.4 and 12.6 GPa, respectively, which are much higher than those of pure NC Ni. These outstanding properties show the potential applicability of NC Ni-B electrodeposits as microgears, micocantilevers, microactuators, and MEMS probe cards, which require high mechanical performance and thermal stability.",
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Electrodeposition and characterization of nanocrystalline Ni-B with low boron content for MEMS applications. / Kwon, Hong Beom; Kim, Kyong Tae; Ahn, Hye Rin; Kim, Yong-Jun.

In: Sensors and Materials, Vol. 29, No. 3, 01.01.2017, p. 225-234.

Research output: Contribution to journalArticle

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